AT438201T - Photovoltaic module and its use - Google Patents

Photovoltaic module and its use

Info

Publication number
AT438201T
AT438201T AT06025105T AT06025105T AT438201T AT 438201 T AT438201 T AT 438201T AT 06025105 T AT06025105 T AT 06025105T AT 06025105 T AT06025105 T AT 06025105T AT 438201 T AT438201 T AT 438201T
Authority
AT
Austria
Prior art keywords
use
photovoltaic module
photovoltaic
module
Prior art date
Application number
AT06025105T
Other languages
German (de)
Inventor
Andreas Bett
Joachim Jaus
Original Assignee
Fraunhofer Ges Forschung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fraunhofer Ges Forschung filed Critical Fraunhofer Ges Forschung
Priority to EP06025105A priority Critical patent/EP1930954B1/en
Publication of AT438201T publication Critical patent/AT438201T/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L25/00Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes
    • H01L25/04Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/041Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L51/00, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L31/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042PV modules or arrays of single PV cells
    • H01L31/05Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells
    • H01L31/0504Electrical interconnection means between PV cells inside the PV module, e.g. series connection of PV cells specially adapted for series or parallel connection of solar cells in a module
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L31/00Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04Semiconductor devices sensitive to infra-red radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus peculiar to the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/052Cooling means directly associated or integrated with the PV cell, e.g. integrated Peltier elements for active cooling or heat sinks directly associated with the PV cells
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144Gold (Au) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732Location after the connecting process
    • H01L2224/73251Location after the connecting process on different surfaces
    • H01L2224/73265Layer and wire connectors
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B10/00Integration of renewable energy sources in buildings
    • Y02B10/10Photovoltaic [PV]
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
AT06025105T 2006-12-05 2006-12-05 Photovoltaic module and its use AT438201T (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP06025105A EP1930954B1 (en) 2006-12-05 2006-12-05 Photovoltaic module and its application

Publications (1)

Publication Number Publication Date
AT438201T true AT438201T (en) 2009-08-15

Family

ID=38016503

Family Applications (1)

Application Number Title Priority Date Filing Date
AT06025105T AT438201T (en) 2006-12-05 2006-12-05 Photovoltaic module and its use

Country Status (9)

Country Link
US (1) US7977567B2 (en)
EP (1) EP1930954B1 (en)
KR (1) KR101426972B1 (en)
CN (1) CN101548394B (en)
AT (1) AT438201T (en)
DE (1) DE502006004401D1 (en)
ES (1) ES2327864T3 (en)
PT (1) PT1930954E (en)
WO (1) WO2008068006A1 (en)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101638753B1 (en) * 2012-07-06 2016-07-11 샌디아 코포레이션 Photovoltaic power generation system free of bypass diodes
CN110082844A (en) * 2009-02-09 2019-08-02 艾克斯瑟乐普林特有限公司 Concentrate type photoelectricity (CPV) module, receiver and sub-receiver and forming method thereof
RU2395136C1 (en) 2009-06-15 2010-07-20 Учреждение Российской академии наук Физико-технический институт им. А.Ф. Иоффе РАН Photovoltaic module
KR100976583B1 (en) * 2010-02-03 2010-08-17 솔라비토(주) Solar voltaic generator
EP2362432B1 (en) * 2010-02-25 2017-06-07 Saint-Augustin Canada Electric Inc. Solar cell assembly
ES2661770T3 (en) * 2010-02-25 2018-04-03 Saint-Augustin Canada Electric Inc. Solar cell set
US20120298168A1 (en) * 2010-11-17 2012-11-29 E. I. Du Pont De Nemours And Company Thin-film photovoltaic cell having an etchant-resistant electrode and an integrated bypass diode and a panel incorporating the same
US20120295395A1 (en) * 2010-11-17 2012-11-22 E.I. Du Pont De Nemours And Company Method for producing an array of thin-film photovoltaic cells having a totally separated integrated bypass diode associated with a plurality of cells and method for producing a panel incorporating the same
US8604330B1 (en) 2010-12-06 2013-12-10 4Power, Llc High-efficiency solar-cell arrays with integrated devices and methods for forming them
ES2509967T3 (en) * 2011-02-24 2014-10-20 Soitec Solar Gmbh Solar cell arrangements for photovoltaic concentrator modules
DE102011012582A1 (en) * 2011-02-28 2012-08-30 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Photovoltaic module and method for its production
RU2475888C1 (en) * 2011-08-02 2013-02-20 Российская Федерация, От Имени Которой Выступает Министерство Промышленности И Торговли Российской Федерации Photovoltaic module design
FR2983346B1 (en) * 2011-11-25 2016-12-09 Soitec Silicon On Insulator Method for preventing an electrical failure in a stack of semiconductor layers, thin-substrate concentration photovoltaic cell, and solar cell assembly
US8581242B2 (en) * 2012-02-21 2013-11-12 Atomic Energy Council—Institute of Nuclear Energy Research Apparatus combining bypass diode and wire
US9917224B2 (en) * 2012-05-29 2018-03-13 Essence Solar Solutions Ltd. Photovoltaic module assembly
KR101349847B1 (en) * 2012-06-13 2014-01-27 희성전자 주식회사 Solar Cell Package including By-Pass Diode
CN103560158B (en) * 2013-11-05 2015-10-21 深圳市昂特尔太阳能投资有限公司 A kind of avris type high concentration solar thermoelectricity is separated receiver
WO2017105581A2 (en) 2015-10-02 2017-06-22 Semprius, Inc. Wafer-integrated, ultra-low profile concentrated photovoltaics (cpv) for space applications
DE102017108223A1 (en) 2017-04-18 2018-10-18 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Photovoltaic module and method for its production
US10615744B2 (en) * 2017-08-13 2020-04-07 The Aerospace Corporation Intelligent solar cell carrier system for flight and laboratory measurement applications

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4577051A (en) * 1984-09-28 1986-03-18 The Standard Oil Company Bypass diode assembly for photovoltaic modules
JP2912496B2 (en) * 1991-09-30 1999-06-28 シャープ株式会社 Solar cell module
US5391235A (en) * 1992-03-31 1995-02-21 Canon Kabushiki Kaisha Solar cell module and method of manufacturing the same
US6248948B1 (en) * 1998-05-15 2001-06-19 Canon Kabushiki Kaisha Solar cell module and method of producing the same
US6252158B1 (en) * 1998-06-16 2001-06-26 Canon Kabushiki Kaisha Photovoltaic element and solar cell module
US6103970A (en) * 1998-08-20 2000-08-15 Tecstar Power Systems, Inc. Solar cell having a front-mounted bypass diode
JP4201241B2 (en) * 2001-05-17 2008-12-24 株式会社カネカ Method for manufacturing integrated thin film photoelectric conversion module
US6690041B2 (en) * 2002-05-14 2004-02-10 Global Solar Energy, Inc. Monolithically integrated diodes in thin-film photovoltaic devices
US8067687B2 (en) * 2002-05-21 2011-11-29 Alliance For Sustainable Energy, Llc High-efficiency, monolithic, multi-bandgap, tandem photovoltaic energy converters
JP2004103959A (en) * 2002-09-11 2004-04-02 Matsushita Electric Ind Co Ltd Solar cell and its manufacturing method
US6784358B2 (en) * 2002-11-08 2004-08-31 The Boeing Co. Solar cell structure utilizing an amorphous silicon discrete by-pass diode
FR2863775B1 (en) * 2003-12-15 2006-04-21 Photowatt Internat Sa Photovoltaic module with an electronic device in the laminated stack.

Also Published As

Publication number Publication date
EP1930954A1 (en) 2008-06-11
US20090272427A1 (en) 2009-11-05
CN101548394B (en) 2011-06-15
KR20090086096A (en) 2009-08-10
PT1930954E (en) 2009-09-01
EP1930954B1 (en) 2009-07-29
DE502006004401D1 (en) 2009-09-10
KR101426972B1 (en) 2014-08-07
US7977567B2 (en) 2011-07-12
ES2327864T3 (en) 2009-11-04
WO2008068006A1 (en) 2008-06-12
CN101548394A (en) 2009-09-30

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Legal Events

Date Code Title Description
REN Ceased due to non-payment of the annual fee