AT426688T - Truck with getter material for a micromechanical construction element - Google Patents

Truck with getter material for a micromechanical construction element

Info

Publication number
AT426688T
AT426688T AT02755628T AT02755628T AT426688T AT 426688 T AT426688 T AT 426688T AT 02755628 T AT02755628 T AT 02755628T AT 02755628 T AT02755628 T AT 02755628T AT 426688 T AT426688 T AT 426688T
Authority
AT
Austria
Prior art keywords
getter
truck
micromechanical construction
micromechanical
construction
Prior art date
Application number
AT02755628T
Other languages
German (de)
Inventor
Marco Amiotti
Original Assignee
Getters Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
Priority to ITMI20011558 priority Critical patent/ITMI20011558A1/en
Priority to ITMI20020688 priority patent/ITMI20020688A1/en
Application filed by Getters Spa filed Critical Getters Spa
Publication of AT426688T publication Critical patent/AT426688T/en
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=26332783&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AT426688(T) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00261Processes for packaging MEMS devices
    • B81C1/00277Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS
    • B81C1/00285Processes for packaging MEMS devices for maintaining a controlled atmosphere inside of the cavity containing the MEMS using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04Coating on selected surface areas, e.g. using masks
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/04Coating on selected surface areas, e.g. using masks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/16Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01JMEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED, VISIBLE OR ULTRA-VIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00Radiation pyrometry
    • G01J5/02Details
    • G01J5/04Casings Mountings
    • G01J5/041Mountings in enclosures or in a particular environment
    • G01J5/045Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701Low temperature co-fired ceramic [LTCC]
AT02755628T 2001-07-20 2002-07-16 Truck with getter material for a micromechanical construction element AT426688T (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
ITMI20011558 ITMI20011558A1 (en) 2001-07-20 2001-07-20 Support for micro-optoelectronic or micromechanical microelectronic devices
ITMI20020688 ITMI20020688A1 (en) 2002-04-03 2002-04-03 Support for micro-optoelectronic or micromechanical microelectronic devices

Publications (1)

Publication Number Publication Date
AT426688T true AT426688T (en) 2009-04-15

Family

ID=26332783

Family Applications (1)

Application Number Title Priority Date Filing Date
AT02755628T AT426688T (en) 2001-07-20 2002-07-16 Truck with getter material for a micromechanical construction element

Country Status (15)

Country Link
US (5) US6897551B2 (en)
EP (1) EP1412550B1 (en)
JP (5) JP4068555B2 (en)
KR (1) KR100611134B1 (en)
CN (1) CN100503879C (en)
AT (1) AT426688T (en)
AU (1) AU2002321832A1 (en)
CA (1) CA2450412C (en)
DE (1) DE60231715D1 (en)
DK (1) DK1412550T3 (en)
ES (1) ES2321913T3 (en)
HK (1) HK1073336A1 (en)
MY (1) MY135763A (en)
TW (1) TW533188B (en)
WO (1) WO2003009318A2 (en)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW583049B (en) * 2001-07-20 2004-04-11 Getters Spa Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
TW533188B (en) * 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
WO2005015637A1 (en) * 2003-08-08 2005-02-17 Matsushita Electric Industrial Co., Ltd. Electronic device and method of producing the same
US7871660B2 (en) * 2003-11-14 2011-01-18 Saes Getters, S.P.A. Preparation of getter surfaces using caustic chemicals
ITMI20032209A1 (en) * 2003-11-14 2005-05-15 Getters Spa Process for the production of devices that require a non-evaporable getter material for their operation.
ITMI20032208A1 (en) * 2003-11-14 2005-05-15 Getters Spa Cathode with integrated getter and low work function for cold cathode lamps.
US8124434B2 (en) 2004-09-27 2012-02-28 Qualcomm Mems Technologies, Inc. Method and system for packaging a display
US20060076634A1 (en) * 2004-09-27 2006-04-13 Lauren Palmateer Method and system for packaging MEMS devices with incorporated getter
ITMI20052343A1 (en) 2005-12-06 2007-06-07 Getters Spa Process for the production of micromechanical devices containing a getter material and devices thus produced
JP2008135690A (en) * 2006-10-30 2008-06-12 Denso Corp Semiconductor physical quantity sensor and method of manufacturing same
US7659150B1 (en) 2007-03-09 2010-02-09 Silicon Clocks, Inc. Microshells for multi-level vacuum cavities
US7923790B1 (en) * 2007-03-09 2011-04-12 Silicon Laboratories Inc. Planar microshells for vacuum encapsulated devices and damascene method of manufacture
US7736929B1 (en) 2007-03-09 2010-06-15 Silicon Clocks, Inc. Thin film microshells incorporating a getter layer
US7595209B1 (en) 2007-03-09 2009-09-29 Silicon Clocks, Inc. Low stress thin film microshells
AT528812T (en) * 2007-08-31 2011-10-15 Univ Denmark Tech Dtu Removal of pollution phases from electrochemical devices
US8349635B1 (en) 2008-05-20 2013-01-08 Silicon Laboratories Inc. Encapsulated MEMS device and method to form the same
FR2933389B1 (en) * 2008-07-01 2010-10-29 Commissariat Energie Atomique STRUCTURE BASED ON SUSPENDED GETTER MATERIAL
JP2010019933A (en) * 2008-07-08 2010-01-28 Seiko Epson Corp Actuator, optical scanner and image forming apparatus
ITMI20090410A1 (en) 2009-03-18 2010-09-19 Getters Spa NON EVAPORABLE GETTER ALLOYS PARTICULARLY SUITABLE FOR HYDROGEN ABSORPTION
FR2950877B1 (en) 2009-10-07 2012-01-13 Commissariat Energie Atomique CAVITY STRUCTURE COMPRISING A BONDING INTERFACE BASED ON MATERIAL GETTER
FR2950876B1 (en) 2009-10-07 2012-02-10 Commissariat Energie Atomique METHOD FOR TREATING A GETTER MATERIAL AND METHOD FOR ENCAPSULATING SUCH A GETTER MATERIAL
JP5298047B2 (en) 2010-02-26 2013-09-25 日立オートモティブシステムズ株式会社 Manufacturing method of composite sensor
FR2967302B1 (en) 2010-11-09 2012-12-21 Commissariat Energie Atomique ENCAPSULATION STRUCTURE OF A MICRO-DEVICE COMPRISING A GETTER MATERIAL
FR2967150A1 (en) 2010-11-09 2012-05-11 Commissariat Energie Atomique PROCESS FOR PRODUCING A SUBSTRATE WITH BURNED LAYERS OF GETTER MATERIAL
US8395229B2 (en) 2011-03-11 2013-03-12 Institut National D'optique MEMS-based getter microdevice
JP5541306B2 (en) 2011-05-27 2014-07-09 株式会社デンソー Mechanical quantity sensor device and manufacturing method thereof
US9491802B2 (en) 2012-02-17 2016-11-08 Honeywell International Inc. On-chip alkali dispenser
DE102012207165A1 (en) 2012-04-30 2013-10-31 Robert Bosch Gmbh Micro-electromechanical device e.g. micro-electromechanical sensor such as inertial sensor, has electrically conductive metallization portion which is arranged on surface of substrate and is partially formed of chemically active getter
EP2736071B8 (en) 2012-11-22 2017-04-19 Tronic's Microsystems S.A. Wafer level package with getter
US9018715B2 (en) 2012-11-30 2015-04-28 Silicon Laboratories Inc. Gas-diffusion barriers for MEMS encapsulation
US10160638B2 (en) 2013-01-04 2018-12-25 Taiwan Semiconductor Manufacturing Company, Ltd. Method and apparatus for a semiconductor structure
US9029773B2 (en) * 2013-02-24 2015-05-12 Vlad Novotny Sealed infrared imagers
US9756731B2 (en) * 2013-02-25 2017-09-05 Kyocera Corporation Package for housing electronic component and electronic device
EP2813464B1 (en) 2013-06-12 2018-08-08 Tronic's Microsystems Device with getter material
EP2813465B1 (en) 2013-06-12 2020-01-15 Tronic's Microsystems MEMS device with getter layer
JP6106331B2 (en) 2014-03-20 2017-03-29 京セラ株式会社 User terminal and device
US9428377B2 (en) 2014-07-25 2016-08-30 Semiconductor Manufacturing International (Shanghai) Corporation Methods and structures for thin-film encapsulation and co-integration of same with microelectronic devices and microelectromechanical systems (MEMS)
DE102017210459A1 (en) 2017-06-22 2018-12-27 Robert Bosch Gmbh Micromechanical device with a first cavity and a second cavity
FR3072788B1 (en) 2017-10-24 2020-05-29 Commissariat A L'energie Atomique Et Aux Energies Alternatives MODULAR INFRARED RADIATION SOURCE
FR3088319B1 (en) 2018-11-08 2020-10-30 Ulis HERMETIC CASE INCLUDING A GETTER, OPTOELECTRONIC COMPONENT OR MEMS DEVICE INTEGRATING SUCH A HERMETIC CASE AND ASSOCIATED MANUFACTURING PROCESS

Family Cites Families (56)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US503261A (en) * 1893-08-15 bereuter
US3214381A (en) * 1962-12-05 1965-10-26 Bell Telephone Labor Inc Barium oxide moisture getter preparation
JPS6255301B2 (en) * 1980-03-31 1987-11-19 Cho Eru Esu Ai Gijutsu Kenkyu Kumiai
US4426769A (en) * 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
US5032461A (en) 1983-12-19 1991-07-16 Spectrum Control, Inc. Method of making a multi-layered article
JPS63198320A (en) 1987-02-13 1988-08-17 Mitsubishi Electric Corp Crystal growth method
US5083466A (en) * 1988-07-14 1992-01-28 University Of Hawaii Multidimensional force sensor
US5192240A (en) * 1990-02-22 1993-03-09 Seiko Epson Corporation Method of manufacturing a microelectronic vacuum device
GB9015820D0 (en) * 1990-07-18 1990-09-05 Raychem Ltd Processing microchips
US5108026A (en) * 1991-05-14 1992-04-28 Motorola Inc. Eutectic bonding of metal to ceramic
JP2814445B2 (en) * 1992-09-16 1998-10-22 インターナショナル・ビジネス・マシーンズ・コーポレイション Selective low-temperature chemical vapor deposition of gold.
KR0139489B1 (en) * 1993-07-08 1998-06-01 호소야 레이지 Electric field radiate type display equipment
JPH09506712A (en) * 1993-12-13 1997-06-30 ハネウエル・インコーポレーテッド Integrated Silicon Vacuum Micro Package for Infrared Devices
JP3456257B2 (en) * 1994-05-27 2003-10-14 株式会社デンソー Electronic device package
US5453659A (en) * 1994-06-10 1995-09-26 Texas Instruments Incorporated Anode plate for flat panel display having integrated getter
JPH0878569A (en) * 1994-09-07 1996-03-22 Nippondenso Co Ltd Package for electronic part
US5599749A (en) * 1994-10-21 1997-02-04 Yamaha Corporation Manufacture of micro electron emitter
CA2162095A1 (en) 1994-12-27 1996-06-28 Jeffery Alan Demeritt Getter housing for electronic packages
US5668018A (en) 1995-06-07 1997-09-16 International Business Machines Corporation Method for defining a region on a wall of a semiconductor structure
US5614785A (en) * 1995-09-28 1997-03-25 Texas Instruments Incorporated Anode plate for flat panel display having silicon getter
JPH09127151A (en) * 1995-11-01 1997-05-16 Murata Mfg Co Ltd Acceleration sensor
US5837935A (en) * 1996-02-26 1998-11-17 Ford Motor Company Hermetic seal for an electronic component having a secondary chamber
JPH09306920A (en) 1996-05-20 1997-11-28 Hitachi Ltd Semiconductor integrated circuit device and its manufacture
JPH09318656A (en) * 1996-05-31 1997-12-12 Hitachi Ltd Electrostatic capacity type acceleration sensor
US5760433A (en) 1996-05-31 1998-06-02 Hughes Electronics In situ reactive layers for protection of ferroelectric integrated circuits
IT1283484B1 (en) * 1996-07-23 1998-04-21 Getters Spa Method for the production of thin supported layers of non-evaporable getter material and getter devices thus produced
US6673400B1 (en) * 1996-10-15 2004-01-06 Texas Instruments Incorporated Hydrogen gettering system
JPH10176768A (en) 1996-11-27 1998-06-30 Xerox Corp Microdevice supporting system and array of microdevice
US5837934A (en) 1996-12-02 1998-11-17 Midway Games Inc. Shock insulated container for hard disk drives
JPH10188460A (en) 1996-12-25 1998-07-21 Sony Corp Optical disk device and optical disk recording medium
IT1290451B1 (en) * 1997-04-03 1998-12-03 Getters Spa Non evaporable getter alloys
US5921461A (en) * 1997-06-11 1999-07-13 Raytheon Company Vacuum package having vacuum-deposited local getter and its preparation
US5951750A (en) * 1997-06-19 1999-09-14 Engelhard Corporation Anti-yellowing polyolefin compositions containing pearlescent pigment to prevent yellowing and method therefore
JPH1140761A (en) 1997-07-23 1999-02-12 Fujitsu Ltd Semiconductor device and manufacture thereof
US5961362A (en) 1997-09-09 1999-10-05 Motorola, Inc. Method for in situ cleaning of electron emitters in a field emission device
US5866978A (en) 1997-09-30 1999-02-02 Fed Corporation Matrix getter for residual gas in vacuum sealed panels
US6359333B1 (en) * 1998-03-31 2002-03-19 Honeywell International Inc. Wafer-pair having deposited layer sealed chambers
US6499354B1 (en) * 1998-05-04 2002-12-31 Integrated Sensing Systems (Issys), Inc. Methods for prevention, reduction, and elimination of outgassing and trapped gases in micromachined devices
US6843936B1 (en) * 1998-10-22 2005-01-18 Texas Instruments Incorporated Getter for enhanced micromechanical device performance
JP3677409B2 (en) * 1999-03-05 2005-08-03 京セラ株式会社 Surface acoustic wave device and manufacturing method thereof
JP2000277525A (en) * 1999-03-26 2000-10-06 Toshiba Ceramics Co Ltd Silicon wafer for semiconductor and its manufacture
IT1312248B1 (en) * 1999-04-12 2002-04-09 Getters Spa Method to increase the productivity of thin distracted deposition processes on a substrate and getter devices for the
US6449354B1 (en) * 1999-06-08 2002-09-10 Nortel Networks Limited Communication system, article and method of configuring and establishing a connection therein
US6265246B1 (en) * 1999-07-23 2001-07-24 Agilent Technologies, Inc. Microcap wafer-level package
US6228675B1 (en) * 1999-07-23 2001-05-08 Agilent Technologies, Inc. Microcap wafer-level package with vias
US6400009B1 (en) * 1999-10-15 2002-06-04 Lucent Technologies Inc. Hermatic firewall for MEMS packaging in flip-chip bonded geometry
GB9927806D0 (en) 1999-11-24 2000-01-26 Isis Innovation Genetic indicators of tobacco consumption
US6477901B1 (en) * 1999-12-21 2002-11-12 Integrated Sensing Systems, Inc. Micromachined fluidic apparatus
JP2001196486A (en) * 2000-01-07 2001-07-19 Murata Mfg Co Ltd Reduced-pressure package structure and manufacturing method thereof
US6410847B1 (en) * 2000-07-25 2002-06-25 Trw Inc. Packaged electronic system having selectively plated microwave absorbing cover
CN1127138C (en) * 2000-09-15 2003-11-05 北京大学 Low-temp MEMS vacuum sealing technique for metals
US6534850B2 (en) * 2001-04-16 2003-03-18 Hewlett-Packard Company Electronic device sealed under vacuum containing a getter and method of operation
TW533188B (en) * 2001-07-20 2003-05-21 Getters Spa Support for microelectronic, microoptoelectronic or micromechanical devices
TW583049B (en) * 2001-07-20 2004-04-11 Getters Spa Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
EP1310380A1 (en) * 2001-11-07 2003-05-14 SensoNor asa A micro-mechanical device and method for producing the same
US6923625B2 (en) * 2002-01-07 2005-08-02 Integrated Sensing Systems, Inc. Method of forming a reactive material and article formed thereby

Also Published As

Publication number Publication date
CA2450412A1 (en) 2003-01-30
ES2321913T3 (en) 2009-06-15
CA2450412C (en) 2008-01-22
JP2014058040A (en) 2014-04-03
MY135763A (en) 2008-06-30
WO2003009318A3 (en) 2003-09-25
CN100503879C (en) 2009-06-24
EP1412550B1 (en) 2009-03-25
TW533188B (en) 2003-05-21
US7808091B2 (en) 2010-10-05
DK1412550T3 (en) 2009-06-02
JP2012051106A (en) 2012-03-15
EP1412550A2 (en) 2004-04-28
US20080073766A1 (en) 2008-03-27
US7566957B2 (en) 2009-07-28
KR20040030828A (en) 2004-04-09
JP2008118147A (en) 2008-05-22
AU2002321832A1 (en) 2003-03-03
US20030230793A9 (en) 2003-12-18
US7534658B2 (en) 2009-05-19
US20050156302A1 (en) 2005-07-21
JP6140259B2 (en) 2017-05-31
WO2003009318A2 (en) 2003-01-30
JP2005510041A (en) 2005-04-14
HK1073336A1 (en) 2005-09-30
US20050158914A1 (en) 2005-07-21
US20030052392A1 (en) 2003-03-20
JP2016047595A (en) 2016-04-07
WO2003009318A8 (en) 2003-04-10
US6897551B2 (en) 2005-05-24
USRE44255E1 (en) 2013-06-04
JP4068555B2 (en) 2008-03-26
DE60231715D1 (en) 2009-05-07
KR100611134B1 (en) 2006-08-10
CN1599806A (en) 2005-03-23

Similar Documents

Publication Publication Date Title
DE60219997D1 (en) tire
DE60208705D1 (en) Dispensing valve assembly
DE60213812D1 (en) Nanover based materials with low permeability
DE60324869D1 (en) reinforcing member
DE60140129D1 (en) REDISPERIBLE LATEX CONTAINS A POLYTHIOPHONE
DE60220031D1 (en) Structure element for a vehicle suspension and method for the production thereof
GB2415945B (en) Pallet assembly
DE60237203D1 (en) AIRSHIP
DE60122219D1 (en) Stereolithographic support structures
GB2401386B (en) Sand screen with integrated sensors
DE50213922D1 (en) gauge
DK1260640T3 (en) infiltration element
DE60013255D1 (en) MICROFLUIDIC CONNECTION
DE60237501D1 (en) BATTERY PACKAGING MATERIAL
AT457228T (en) In-situ microvercaped adhesive
HK1048835A1 (en) Pneumatic structural element.
DE60209105D1 (en) Tire
DE60218971D1 (en) Magnetoresistive element
DE60209567D1 (en) SCREWCAP
DE60233463D1 (en) Force sensor
ZA200304637B (en) A reinforced permeable structure.
AT465707T (en) Checking the vacuum change rate
DE60237167D1 (en) N / A
DE60227395D1 (en) TIRE
DK1321097T3 (en) Wireless position sensor

Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification

Ref document number: 1412550

Country of ref document: EP