AT388487T - Device for cooling semiconductor components on pcb - Google Patents

Device for cooling semiconductor components on pcb

Info

Publication number
AT388487T
AT388487T AT03018046T AT03018046T AT388487T AT 388487 T AT388487 T AT 388487T AT 03018046 T AT03018046 T AT 03018046T AT 03018046 T AT03018046 T AT 03018046T AT 388487 T AT388487 T AT 388487T
Authority
AT
Austria
Prior art keywords
pcb
device
semiconductor components
cooling semiconductor
cooling
Prior art date
Application number
AT03018046T
Other languages
German (de)
Inventor
Stefan Schmidberger
Original Assignee
Harman Becker Automotive Sys
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Harman Becker Automotive Sys filed Critical Harman Becker Automotive Sys
Priority to EP20030018046 priority Critical patent/EP1508916B1/en
Publication of AT388487T publication Critical patent/AT388487T/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433Auxiliary members in containers characterised by their shape, e.g. pistons
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
AT03018046T 2003-08-07 2003-08-07 Device for cooling semiconductor components on pcb AT388487T (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20030018046 EP1508916B1 (en) 2003-08-07 2003-08-07 Apparatus for cooling semiconductor devices attached to a printed circuit board

Publications (1)

Publication Number Publication Date
AT388487T true AT388487T (en) 2008-03-15

Family

ID=34042843

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03018046T AT388487T (en) 2003-08-07 2003-08-07 Device for cooling semiconductor components on pcb

Country Status (4)

Country Link
US (1) US7187553B2 (en)
EP (1) EP1508916B1 (en)
AT (1) AT388487T (en)
DE (1) DE60319523T2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7321492B2 (en) * 2005-02-15 2008-01-22 Inventec Corporation Heat sink module for an electronic device
JP2006245356A (en) * 2005-03-04 2006-09-14 Hitachi Ltd Cooling apparatus of electronic device
US7515418B2 (en) 2005-09-26 2009-04-07 Curtiss-Wright Controls, Inc. Adjustable height liquid cooler in liquid flow through plate
US7583504B2 (en) * 2005-11-11 2009-09-01 Telefonaktiebolaget L M Ericsson (Publ) Cooling assembly
US7995344B2 (en) * 2007-01-09 2011-08-09 Lockheed Martin Corporation High performance large tolerance heat sink
TW200834285A (en) * 2007-02-02 2008-08-16 Compal Electronics Inc Fastening structure for reducing surface temperature of housing
JP4400662B2 (en) * 2007-09-12 2010-01-20 株式会社デンソー Electronic circuit component mounting structure
JP5324773B2 (en) * 2007-11-06 2013-10-23 インターナショナル・ビジネス・マシーンズ・コーポレーションInternational Business Machines Corporation Circuit module and manufacturing method thereof
AT507352B1 (en) * 2008-10-01 2013-04-15 Siemens Ag Cooling arrangement
JP5402200B2 (en) * 2009-04-20 2014-01-29 株式会社リコー Heat transfer mechanism and information equipment
US7957148B1 (en) * 2009-12-08 2011-06-07 International Business Machines Corporation Low profile computer processor retention device
US20110162828A1 (en) * 2010-01-06 2011-07-07 Graham Charles Kirk Thermal plug for use with a heat sink and method of assembling same
US9578783B2 (en) * 2010-02-25 2017-02-21 Thomson Licensing Miniature multilayer radiative cooling case wtih hidden quick release snaps
US8451600B1 (en) * 2010-03-04 2013-05-28 Amazon Technologies, Inc. Heat spreading chassis for rack-mounted computer system
WO2011146302A1 (en) 2010-05-19 2011-11-24 Technicolor Usa Inc Set-top box having dissipating thermal loads
US20130077256A1 (en) * 2010-06-09 2013-03-28 Sharp Kabushiki Kaisha Heat dissipation structure for electronic device
CN102906869A (en) * 2010-06-14 2013-01-30 夏普株式会社 Electronic device, display device, and television receiver
CN102906870A (en) * 2010-06-18 2013-01-30 夏普株式会社 Heat dissipation structure for electronic device
WO2012008205A1 (en) * 2010-07-14 2012-01-19 シャープ株式会社 Electronic device and display device
JP5510432B2 (en) * 2011-02-28 2014-06-04 株式会社豊田自動織機 Semiconductor device
BR112013022150A2 (en) 2011-03-09 2016-12-06 Thomson Licensing line or server peripheral assembly incorporating smart card reader and thermal absorption pickup
CN103703875B (en) 2011-07-14 2016-10-12 汤姆逊许可公司 There is buckle type radiator and smart card reader, Set Top Box with the fixed component for keeping radiator
JP5644706B2 (en) * 2011-07-19 2014-12-24 株式会社豊田自動織機 Electronic component fixing structure for electric compressor
US8541875B2 (en) * 2011-09-30 2013-09-24 Alliance For Sustainable Energy, Llc Integrated three-dimensional module heat exchanger for power electronics cooling
TWI504852B (en) * 2012-09-07 2015-10-21 Compal Electronics Inc Thermal dissipating module
US9049811B2 (en) * 2012-11-29 2015-06-02 Bose Corporation Circuit cooling
JP5751273B2 (en) * 2013-04-02 2015-07-22 トヨタ自動車株式会社 semiconductor device
US9379039B2 (en) * 2013-09-04 2016-06-28 Cisco Technology, Inc. Heat transfer for electronic equipment
US10455686B2 (en) * 2016-08-19 2019-10-22 Panasonic Automotive Systems Company Of America, Division Of Panasonic Corporation Of North America Clamping spring design to apply clamping force to SMT power amplifier device
US10638647B1 (en) * 2017-12-30 2020-04-28 Xeleum Lighting Attaching printed circuit board to heat exchanger
JP2019160976A (en) * 2018-03-12 2019-09-19 富士通株式会社 Board with cooling mechanism

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3477101D1 (en) 1983-03-25 1989-04-13 Mitsubishi Electric Corp Heat radiator assembly for cooling electronic parts
FR2679729B1 (en) * 1991-07-23 1994-04-29 Alcatel Telspace Heatsink.
US6046905A (en) * 1996-09-30 2000-04-04 Intel Corporation Dual spring clip attachment mechanism for controlled pressure interface thermal solution on processor cartridges
US5883782A (en) * 1997-03-05 1999-03-16 Intel Corporation Apparatus for attaching a heat sink to a PCB mounted semiconductor package
US5883783A (en) * 1997-07-15 1999-03-16 Intel Corporation GT clip design for an electronic packaging assembly
US5920120A (en) * 1997-12-19 1999-07-06 Intel Corporation Assembly for dissipatating heat from a semiconductor chip wherein a stress on the semiconductor chip due to a thermally conductive member is partially relieved
US6154365A (en) * 1999-02-26 2000-11-28 Intel Corporation Spring fixture that attaches a heat sink to a substrate for multiple cycle assembly/disassembly
US6256199B1 (en) * 1999-10-01 2001-07-03 Intel Corporation Integrated circuit cartridge and method of fabricating the same
JP3602771B2 (en) * 2000-05-12 2004-12-15 富士通株式会社 Portable electronic devices
US6469893B1 (en) * 2000-09-29 2002-10-22 Intel Corporation Direct heatpipe attachment to die using center point loading
TW560643U (en) * 2002-01-30 2003-11-01 Hon Hai Prec Ind Co Ltd Backplate of heat sink
EP1333492B1 (en) * 2002-11-08 2006-03-01 Agilent Technologies Inc. a Delaware Corporation Cooling a microchip on a circuit board
US6885557B2 (en) * 2003-04-24 2005-04-26 Intel Corporaiton Heatsink assembly

Also Published As

Publication number Publication date
US7187553B2 (en) 2007-03-06
EP1508916B1 (en) 2008-03-05
EP1508916A1 (en) 2005-02-23
DE60319523T2 (en) 2009-03-26
US20050128713A1 (en) 2005-06-16
DE60319523D1 (en) 2008-04-17

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties