AT384621T - Liquid head head and liquid beam device - Google Patents

Liquid head head and liquid beam device

Info

Publication number
AT384621T
AT384621T AT03013396T AT03013396T AT384621T AT 384621 T AT384621 T AT 384621T AT 03013396 T AT03013396 T AT 03013396T AT 03013396 T AT03013396 T AT 03013396T AT 384621 T AT384621 T AT 384621T
Authority
AT
Austria
Prior art keywords
liquid
head
liquid head
head head
Prior art date
Application number
AT03013396T
Other languages
German (de)
Inventor
Yoshinao Miyata
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2002179228A priority Critical patent/JP4338944B2/en
Priority to JP2002190022A priority patent/JP4344116B2/en
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Publication of AT384621T publication Critical patent/AT384621T/en

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2/14201Structure of print heads with piezoelectric elements
    • B41J2/14233Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm
    • B41J2002/14241Structure of print heads with piezoelectric elements of film type, deformed by bending and disposed on a diaphragm having a cover around the piezoelectric thin film element
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41JTYPEWRITERS; SELECTIVE PRINTING MECHANISMS, e.g. INK-JET PRINTERS, THERMAL PRINTERS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01Ink jet
    • B41J2/135Nozzles
    • B41J2/14Structure thereof only for on-demand ink jet heads
    • B41J2002/14491Electrical connection
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/4813Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191Disposition
    • H01L2924/19101Disposition of discrete passive components
    • H01L2924/19107Disposition of discrete passive components off-chip wires
AT03013396T 2002-06-19 2003-06-18 Liquid head head and liquid beam device AT384621T (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2002179228A JP4338944B2 (en) 2002-06-19 2002-06-19 Liquid ejecting head and liquid ejecting apparatus
JP2002190022A JP4344116B2 (en) 2002-06-28 2002-06-28 Liquid ejecting head and liquid ejecting apparatus

Publications (1)

Publication Number Publication Date
AT384621T true AT384621T (en) 2008-02-15

Family

ID=29718411

Family Applications (1)

Application Number Title Priority Date Filing Date
AT03013396T AT384621T (en) 2002-06-19 2003-06-18 Liquid head head and liquid beam device

Country Status (5)

Country Link
US (1) US6886923B2 (en)
EP (1) EP1375150B1 (en)
CN (2) CN1240542C (en)
AT (1) AT384621T (en)
DE (1) DE60318772T2 (en)

Families Citing this family (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4135697B2 (en) * 2004-09-30 2008-08-20 富士フイルム株式会社 Liquid ejection head and image forming apparatus
JP4492520B2 (en) 2005-01-26 2010-06-30 セイコーエプソン株式会社 Droplet discharge head and droplet discharge device.
JP4614070B2 (en) * 2005-02-14 2011-01-19 セイコーエプソン株式会社 Liquid ejecting head and liquid ejecting apparatus
JP4640649B2 (en) * 2006-03-17 2011-03-02 セイコーエプソン株式会社 Droplet discharge head, image forming apparatus, and film forming apparatus
JP2008213434A (en) * 2007-03-08 2008-09-18 Fuji Xerox Co Ltd Droplet ejection head, droplet ejection device, and image forming device
JP2009255524A (en) * 2008-03-25 2009-11-05 Seiko Epson Corp Liquid jetting head and liquid jetting device
US8360557B2 (en) * 2008-12-05 2013-01-29 Xerox Corporation Method for laser drilling fluid ports in multiple layers
JP4697325B2 (en) * 2009-03-30 2011-06-08 ブラザー工業株式会社 Drive control device
JP5477036B2 (en) * 2010-02-18 2014-04-23 セイコーエプソン株式会社 Liquid jet head
JP2011167964A (en) * 2010-02-19 2011-09-01 Seiko Epson Corp Liquid ejection head
EP2569163B8 (en) * 2010-05-11 2019-06-19 Hewlett-Packard Development Company, L.P. Ink pen electrical interface
JP5397366B2 (en) * 2010-12-21 2014-01-22 ブラザー工業株式会社 Piezoelectric actuator device
JP5853379B2 (en) 2011-03-07 2016-02-09 株式会社リコー Droplet discharge head and droplet discharge apparatus
JP6056329B2 (en) * 2012-09-27 2017-01-11 セイコーエプソン株式会社 Droplet discharge head, printing apparatus, and method of manufacturing droplet discharge head
JP6167715B2 (en) * 2013-07-17 2017-07-26 セイコーエプソン株式会社 Liquid jet head
CN104441996B (en) * 2013-09-22 2016-03-23 珠海赛纳打印科技股份有限公司 The manufacture method of liquid ink nozzle, liquid ink nozzle and printing device
CN104708906B (en) * 2013-12-17 2017-02-08 珠海赛纳打印科技股份有限公司 Liquid jet device and printer
JP6452352B2 (en) * 2014-08-29 2019-01-16 キヤノン株式会社 Liquid discharge head and manufacturing method thereof
US9802407B2 (en) * 2014-11-27 2017-10-31 Ricoh Company, Ltd Liquid discharge head, liquid discharge device, and liquid discharge apparatus
JP6372618B2 (en) * 2014-12-09 2018-08-15 セイコーエプソン株式会社 Piezoelectric device, liquid ejecting head, piezoelectric device manufacturing method, and liquid ejecting head manufacturing method
JP6589301B2 (en) * 2015-03-10 2019-10-16 セイコーエプソン株式会社 Liquid ejecting head and method of manufacturing liquid ejecting head
JP6493665B2 (en) 2015-03-13 2019-04-03 セイコーエプソン株式会社 MEMS device, liquid ejecting head, and liquid ejecting apparatus
US10272672B2 (en) * 2016-12-22 2019-04-30 Seiko Epson Corporation Head unit, liquid discharge apparatus, and manufacturing method of head unit

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05286131A (en) 1992-04-15 1993-11-02 Rohm Co Ltd Ink jet print head and production thereof
JPH07144406A (en) 1993-11-22 1995-06-06 Canon Inc Ink jet recording head and ink jet recorder
JPH08187860A (en) 1995-01-09 1996-07-23 Canon Inc Liquid jet recording head and liquid jet recorder placing the same
JPH09109389A (en) * 1995-10-23 1997-04-28 Rohm Co Ltd Recording element driving integrated circuit for ink jet recorder
JPH10100401A (en) * 1996-10-02 1998-04-21 Ricoh Co Ltd Ink jet head
EP0931650B1 (en) * 1997-06-17 2010-04-21 Seiko Epson Corporation Ink jet recording head
JPH11157076A (en) * 1997-09-22 1999-06-15 Ricoh Co Ltd Ink-jet recording apparatus
CN1172800C (en) * 1998-11-04 2004-10-27 松下电器产业株式会社 Ink-jet printing head and its manufacturing method
AT382482T (en) * 1999-03-29 2008-01-15 Seiko Epson Corp Ink jet recording device
JP3415789B2 (en) 1999-06-10 2003-06-09 松下電器産業株式会社 Ink jet head and ink jet printer
JP2001088302A (en) * 1999-09-27 2001-04-03 Nec Corp Ink jet recording head and manufacture thereof

Also Published As

Publication number Publication date
CN1486845A (en) 2004-04-07
US20040001122A1 (en) 2004-01-01
EP1375150B1 (en) 2008-01-23
CN1240542C (en) 2006-02-08
DE60318772D1 (en) 2008-03-13
DE60318772T2 (en) 2009-01-22
EP1375150A1 (en) 2004-01-02
CN2719571Y (en) 2005-08-24
US6886923B2 (en) 2005-05-03

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Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties