AT324671T - Light-emitting diode with improved heat transparency - Google Patents

Light-emitting diode with improved heat transparency

Info

Publication number
AT324671T
AT324671T AT00126394T AT00126394T AT324671T AT 324671 T AT324671 T AT 324671T AT 00126394 T AT00126394 T AT 00126394T AT 00126394 T AT00126394 T AT 00126394T AT 324671 T AT324671 T AT 324671T
Authority
AT
Austria
Prior art keywords
light
emitting diode
improved heat
heat transparency
transparency
Prior art date
Application number
AT00126394T
Other languages
German (de)
Inventor
Mu-Chin Yu
Original Assignee
Mu-Chin Yu
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mu-Chin Yu filed Critical Mu-Chin Yu
Priority to EP20000126394 priority Critical patent/EP1211735B1/en
Publication of AT324671T publication Critical patent/AT324671T/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/647Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/12Passive devices, e.g. 2 terminal devices
    • H01L2924/1204Optical Diode
    • H01L2924/12041LED
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • H01L33/642Heat extraction or cooling elements characterized by the shape
AT00126394T 2000-12-04 2000-12-04 Light-emitting diode with improved heat transparency AT324671T (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP20000126394 EP1211735B1 (en) 2000-12-04 2000-12-04 Light emitting diode with improved heat dissipation

Publications (1)

Publication Number Publication Date
AT324671T true AT324671T (en) 2006-05-15

Family

ID=8170554

Family Applications (1)

Application Number Title Priority Date Filing Date
AT00126394T AT324671T (en) 2000-12-04 2000-12-04 Light-emitting diode with improved heat transparency

Country Status (3)

Country Link
EP (1) EP1211735B1 (en)
AT (1) AT324671T (en)
DE (1) DE60027579D1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030058650A1 (en) * 2001-09-25 2003-03-27 Kelvin Shih Light emitting diode with integrated heat dissipater
JP5569558B2 (en) * 2012-06-06 2014-08-13 第一精工株式会社 Housing for electrical parts

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2315709A1 (en) * 1973-03-29 1974-10-10 Licentia Gmbh Radiation-emitting semiconductor device comprising a high radiated power
US4478588A (en) * 1978-03-06 1984-10-23 Amp Incorporated Light emitting diode assembly
JPH06204604A (en) * 1993-01-06 1994-07-22 Sanyo Electric Co Ltd Semiconductor laser device
JPH07335980A (en) * 1994-06-07 1995-12-22 Fuji Electric Co Ltd Semiconductor laser device
US5660461A (en) * 1994-12-08 1997-08-26 Quantum Devices, Inc. Arrays of optoelectronic devices and method of making same
EP1004145B1 (en) * 1997-07-29 2005-06-01 Osram Opto Semiconductors GmbH Optoelectronic component
WO1999060626A1 (en) * 1998-05-20 1999-11-25 Rohm Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
EP1211735A1 (en) 2002-06-05
EP1211735B1 (en) 2006-04-26
DE60027579D1 (en) 2006-06-01

Similar Documents

Publication Publication Date Title
DE60226964D1 (en) Schallantriebs toothbrush with multiple containers
DE60033639D1 (en) Lamp
DE60232074D1 (en) Illuminated signs with light diodes
DE50110249D1 (en) Lamp
DE60219171D1 (en) Led indicator light
DE60135991D1 (en) Carton with handlebar
DE60306720D1 (en) Device with organic light-emitting diodes
DE60306721D1 (en) Device with organic light-emitting diodes
DE60125398D1 (en) Intelligent laser with fast deformable grille
DE60230537D1 (en) Aromated silylmonomers with high breaking index
GB2380856B (en) Lighting unit with improved cooling
TWI349693B (en) White light-emitting device with improved doping
DE60235333D1 (en) Translucent hood
DE60209535D1 (en) Carton with handlebar
DE60109627D1 (en) Thermal transmission of light-emitting polymers
DE60115686D1 (en) Bed with radiant guard elements
DE60036733D1 (en) Surface lighting device
DE50213435D1 (en) Fuel injection valve-spark-combination
GB2361356B (en) Light emitting device
DK1468226T3 (en) Heat source or heat sink with thermal earth connection
DK1344429T3 (en) lighting device
DE60045140D1 (en) Lighting device
TWI349375B (en) High-powered light emitting device with improved thermal properties
DE60118801D1 (en) Polymermal with high breaking index
DE60143106D1 (en) Light-emitting element and azole compound

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties