AT311604T - Test system of integrated circuits - Google Patents

Test system of integrated circuits

Info

Publication number
AT311604T
AT311604T AT01946604T AT01946604T AT311604T AT 311604 T AT311604 T AT 311604T AT 01946604 T AT01946604 T AT 01946604T AT 01946604 T AT01946604 T AT 01946604T AT 311604 T AT311604 T AT 311604T
Authority
AT
Austria
Prior art keywords
integrated circuits
test system
test
system
circuits
Prior art date
Application number
AT01946604T
Other languages
German (de)
Inventor
Sammy Mok
Fu Chiung Chong
Original Assignee
Nanonexus Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to US21292300P priority Critical
Priority to US21372900P priority
Application filed by Nanonexus Inc filed Critical Nanonexus Inc
Priority to PCT/US2001/019792 priority patent/WO2001098793A2/en
Publication of AT311604T publication Critical patent/AT311604T/en

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/28Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3114Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the device being a chip scale package, e.g. CSP
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/10Bump connectors ; Manufacturing methods related thereto
    • H01L24/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L24/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/71Means for bonding not being attached to, or not being formed on, the surface to be connected
    • H01L24/72Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716Elastic
    • G01R1/06727Cantilever beams
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10Bump connectors; Manufacturing methods related thereto
    • H01L2224/12Structure, shape, material or disposition of the bump connectors prior to the connecting process
    • H01L2224/13Structure, shape, material or disposition of the bump connectors prior to the connecting process of an individual bump connector
    • H01L2224/13001Core members of the bump connector
    • H01L2224/13099Material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/27Manufacturing methods
    • H01L2224/274Manufacturing methods by blanket deposition of the material of the layer connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/75Apparatus for connecting with bump connectors or layer connectors
    • H01L2224/7525Means for applying energy, e.g. heating means
    • H01L2224/75251Means for applying energy, e.g. heating means in the lower part of the bonding apparatus, e.g. in the apparatus chuck
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01005Boron [B]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01006Carbon [C]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01013Aluminum [Al]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01015Phosphorus [P]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01019Potassium [K]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/0102Calcium [Ca]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01022Titanium [Ti]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01023Vanadium [V]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01027Cobalt [Co]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01029Copper [Cu]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01033Arsenic [As]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01039Yttrium [Y]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01045Rhodium [Rh]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01046Palladium [Pd]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01047Silver [Ag]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01074Tungsten [W]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01075Rhenium [Re]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01078Platinum [Pt]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01079Gold [Au]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01Chemical elements
    • H01L2924/01082Lead [Pb]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013Alloys
    • H01L2924/014Solder alloys
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/102Material of the semiconductor or solid state bodies
    • H01L2924/1025Semiconducting materials
    • H01L2924/10251Elemental semiconductors, i.e. Group IV
    • H01L2924/10253Silicon [Si]
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10Details of semiconductor or other solid state devices to be connected
    • H01L2924/11Device type
    • H01L2924/14Integrated circuits
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19041Component type being a capacitor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19042Component type being an inductor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/1901Structure
    • H01L2924/1904Component type
    • H01L2924/19043Component type being a resistor
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30105Capacitance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/30107Inductance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3011Impedance
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/301Electrical effects
    • H01L2924/3025Electromagnetic shielding
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30Technical effects
    • H01L2924/35Mechanical effects
    • H01L2924/351Thermal stress
AT01946604T 2000-06-20 2001-06-20 Test system of integrated circuits AT311604T (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US21292300P true 2000-06-20 2000-06-20
US21372900P true 2000-06-22 2000-06-22
PCT/US2001/019792 WO2001098793A2 (en) 2000-06-20 2001-06-20 Systems for testing integraged circuits during burn-in

Publications (1)

Publication Number Publication Date
AT311604T true AT311604T (en) 2005-12-15

Family

ID=26907616

Family Applications (1)

Application Number Title Priority Date Filing Date
AT01946604T AT311604T (en) 2000-06-20 2001-06-20 Test system of integrated circuits

Country Status (7)

Country Link
US (1) US6791171B2 (en)
EP (1) EP1292834B1 (en)
JP (1) JP2004501517A (en)
AT (1) AT311604T (en)
AU (1) AU6863001A (en)
DE (1) DE60115437T2 (en)
WO (1) WO2001098793A2 (en)

Families Citing this family (78)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6331763B1 (en) * 1998-04-15 2001-12-18 Tyco Electronics Corporation Devices and methods for protection of rechargeable elements
US7382142B2 (en) 2000-05-23 2008-06-03 Nanonexus, Inc. High density interconnect system having rapid fabrication cycle
US7952373B2 (en) 2000-05-23 2011-05-31 Verigy (Singapore) Pte. Ltd. Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies
US6812718B1 (en) * 1999-05-27 2004-11-02 Nanonexus, Inc. Massively parallel interface for electronic circuits
US6917525B2 (en) * 2001-11-27 2005-07-12 Nanonexus, Inc. Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
US7132841B1 (en) * 2000-06-06 2006-11-07 International Business Machines Corporation Carrier for test, burn-in, and first level packaging
US6690184B1 (en) * 2000-08-31 2004-02-10 Micron Technology, Inc. Air socket for testing integrated circuits
US6564986B1 (en) * 2001-03-08 2003-05-20 Xilinx, Inc. Method and assembly for testing solder joint fractures between integrated circuit package and printed circuit board
WO2003073434A1 (en) * 2002-02-26 2003-09-04 Koninklijke Philips Electronics N.V. Non-volatile memory test structure and method
US7137830B2 (en) * 2002-03-18 2006-11-21 Nanonexus, Inc. Miniaturized contact spring
US7694246B2 (en) * 2002-06-19 2010-04-06 Formfactor, Inc. Test method for yielding a known good die
US8198576B2 (en) 2003-03-28 2012-06-12 Aprolase Development Co., Llc Three-dimensional LADAR module with alignment reference insert circuitry comprising high density interconnect structure
USRE43722E1 (en) 2003-03-28 2012-10-09 Aprolase Development Co., Llc Three-dimensional ladar module with alignment reference insert circuitry
US7114961B2 (en) 2003-04-11 2006-10-03 Neoconix, Inc. Electrical connector on a flexible carrier
US8584353B2 (en) 2003-04-11 2013-11-19 Neoconix, Inc. Method for fabricating a contact grid array
US7056131B1 (en) 2003-04-11 2006-06-06 Neoconix, Inc. Contact grid array system
US7758351B2 (en) 2003-04-11 2010-07-20 Neoconix, Inc. Method and system for batch manufacturing of spring elements
JP4062168B2 (en) * 2003-05-19 2008-03-19 ソニー株式会社 Structure of the terminal member
US7321167B2 (en) * 2003-06-04 2008-01-22 Intel Corporation Flex tape architecture for integrated circuit signal ingress/egress
US7113408B2 (en) * 2003-06-11 2006-09-26 Neoconix, Inc. Contact grid array formed on a printed circuit board
US6869290B2 (en) * 2003-06-11 2005-03-22 Neoconix, Inc. Circuitized connector for land grid array
US6933853B2 (en) * 2003-06-12 2005-08-23 Hewlett-Packard Development Company, L.P. Apparatus and method for detecting and communicating interconnect failures
US20050024220A1 (en) * 2003-06-12 2005-02-03 Shidla Dale John Built-in circuitry and method to test connectivity to integrated circuit
US7087439B2 (en) * 2003-09-04 2006-08-08 Hewlett-Packard Development Company, L.P. Method and apparatus for thermally assisted testing of integrated circuits
US7093209B2 (en) * 2003-09-16 2006-08-15 Advanced Micro Devices, Inc. Method and apparatus for packaging test integrated circuits
US6973722B2 (en) * 2003-11-17 2005-12-13 Palo Alto Research Center Incorporated Release height adjustment of stressy metal devices by annealing before and after release
US7244125B2 (en) 2003-12-08 2007-07-17 Neoconix, Inc. Connector for making electrical contact at semiconductor scales
US20050120553A1 (en) * 2003-12-08 2005-06-09 Brown Dirk D. Method for forming MEMS grid array connector
US7025601B2 (en) * 2004-03-19 2006-04-11 Neoconix, Inc. Interposer and method for making same
WO2005091998A2 (en) 2004-03-19 2005-10-06 Neoconix, Inc. Electrical connector in a flexible host
US7400041B2 (en) * 2004-04-26 2008-07-15 Sriram Muthukumar Compliant multi-composition interconnects
JP4727948B2 (en) 2004-05-24 2011-07-20 東京エレクトロン株式会社 Laminated substrate for use in a probe card
US7750487B2 (en) * 2004-08-11 2010-07-06 Intel Corporation Metal-metal bonding of compliant interconnect
US7459795B2 (en) * 2004-08-19 2008-12-02 Formfactor, Inc. Method to build a wirebond probe card in a many at a time fashion
US7114959B2 (en) * 2004-08-25 2006-10-03 Intel Corporation Land grid array with socket plate
US7049208B2 (en) * 2004-10-11 2006-05-23 Intel Corporation Method of manufacturing of thin based substrate
US7777313B2 (en) * 2005-06-07 2010-08-17 Analog Devices, Inc. Electronic package structures and methods
US7439731B2 (en) * 2005-06-24 2008-10-21 Crafts Douglas E Temporary planar electrical contact device and method using vertically-compressible nanotube contact structures
US20070052084A1 (en) * 2005-08-26 2007-03-08 Kennedy John V High density interconnect assembly comprising stacked electronic module
JP4599265B2 (en) * 2005-09-27 2010-12-15 アルプス電気株式会社 Interposer
US8031486B2 (en) * 2005-11-16 2011-10-04 Hamilton Sundstrand Corporation Electrical distribution system and modular high power board contactor therefor
US7692433B2 (en) * 2006-06-16 2010-04-06 Formfactor, Inc. Sawing tile corners on probe card substrates
US7782072B2 (en) * 2006-09-27 2010-08-24 Formfactor, Inc. Single support structure probe group with staggered mounting pattern
US8185849B2 (en) * 2006-10-11 2012-05-22 Zuken Inc. Electric information processing method in CAD system, device thereof, program, and computer readable storage medium
US8130007B2 (en) * 2006-10-16 2012-03-06 Formfactor, Inc. Probe card assembly with carbon nanotube probes having a spring mechanism therein
US8248091B2 (en) 2006-10-20 2012-08-21 Taiwan Semiconductor Manufacturing Co., Ltd. Universal array type probe card design for semiconductor device testing
US7882405B2 (en) * 2007-02-16 2011-02-01 Atmel Corporation Embedded architecture with serial interface for testing flash memories
DE102007010677A1 (en) * 2007-03-02 2008-09-04 Conti Temic Microelectronic Gmbh Contact unit for electrical contact of component, has base plate and spring arm projecting in inclined manner from base plate level, and spring arm has two spring sections
DE102007010611A1 (en) * 2007-03-02 2008-09-04 Conti Temic Microelectronic Gmbh Contact unit for electrical contacting of component, for producing electrical contact between easily removable electronic component and electrical circuit, and for device, has spring arm that is surrounded by baseplate
FR2917236B1 (en) 2007-06-07 2009-10-23 Commissariat Energie Atomique via making method in a substrate reconstituted.
JP2009130114A (en) * 2007-11-22 2009-06-11 Tokyo Electron Ltd Inspecting apparatus
US8033012B2 (en) * 2008-03-07 2011-10-11 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating a semiconductor test probe card space transformer
US8310682B2 (en) 2008-03-20 2012-11-13 University Of Utah Research Foundation Apparatus, system and methods for analyzing pressure-sensitive devices
US8257119B2 (en) * 2008-12-19 2012-09-04 Honeywell International Systems and methods for affixing a silicon device to a support structure
US7888951B2 (en) 2009-02-10 2011-02-15 Qualitau, Inc. Integrated unit for electrical/reliability testing with improved thermal control
US20110042137A1 (en) * 2009-08-18 2011-02-24 Honeywell International Inc. Suspended lead frame electronic package
US8278752B2 (en) * 2009-12-23 2012-10-02 Intel Corporation Microelectronic package and method for a compression-based mid-level interconnect
FR2959350B1 (en) * 2010-04-26 2012-08-31 Commissariat Energie Atomique Method of manufacturing? A microelectronic device and manufactures microelectronics and device
US8441808B2 (en) * 2010-09-22 2013-05-14 Palo Alto Research Center Incorporated Interposer with microspring contacts
US8519534B2 (en) * 2010-09-22 2013-08-27 Palo Alto Research Center Incorporated Microsprings partially embedded in a laminate structure and methods for producing same
US8872176B2 (en) 2010-10-06 2014-10-28 Formfactor, Inc. Elastic encapsulated carbon nanotube based electrical contacts
US8257110B2 (en) * 2010-10-07 2012-09-04 Tsmc Solid State Lighting Ltd. Light emitting diode light bar module with electrical connectors formed by injection molding
US8384269B2 (en) * 2010-10-20 2013-02-26 Avago Technologies Wireless Ip (Singapore) Pte. Ltd. Electrostatic bonding of a die substrate to a package substrate
US9227835B2 (en) * 2010-11-23 2016-01-05 Honeywell International Inc. Vibration isolation interposer die
US8866708B2 (en) * 2011-01-21 2014-10-21 Peter Sui Lun Fong Light emitting diode switch device and array
KR101149759B1 (en) * 2011-03-14 2012-06-01 리노공업주식회사 A testing apparatus of the semiconductor device
US8641428B2 (en) 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
JP2014071069A (en) * 2012-10-01 2014-04-21 Japan Electronic Materials Corp Vertical type probe
US9680273B2 (en) 2013-03-15 2017-06-13 Neoconix, Inc Electrical connector with electrical contacts protected by a layer of compressible material and method of making it
TWI503905B (en) * 2013-05-09 2015-10-11 Siliconware Prec Ind Co Ltd Wire-bonding structure
US20140361800A1 (en) * 2013-06-05 2014-12-11 Qualcomm Incorporated Method and apparatus for high volume system level testing of logic devices with pop memory
KR101544844B1 (en) * 2014-02-28 2015-08-20 김형익 Wired rubber contact and method of manufacturing the same
US9591758B2 (en) * 2014-03-27 2017-03-07 Intel Corporation Flexible electronic system with wire bonds
JP2015211162A (en) * 2014-04-28 2015-11-24 旭硝子株式会社 Method for manufacturing glass member, glass member, and glass interposer
US9466560B2 (en) * 2014-05-28 2016-10-11 United Microelectronics Corp. Interposer fabricating process and wafer packaging structure
CN108025906A (en) * 2015-09-30 2018-05-11 Tdk株式会社 Resiliently mounted sensor system with damping
US9726720B2 (en) * 2015-11-02 2017-08-08 Cheng Yun Technology Co., Ltd. Integrated circuit test device and integrated circuit test equipment

Family Cites Families (74)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3842189A (en) * 1973-01-08 1974-10-15 Rca Corp Contact array and method of making the same
US4035046A (en) * 1976-01-15 1977-07-12 Amp Incorporated Miniature electrical connector for parallel panel members
US4320438A (en) 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
US4423401A (en) 1982-07-21 1983-12-27 Tektronix, Inc. Thin-film electrothermal device
US4758927A (en) 1987-01-21 1988-07-19 Tektronix, Inc. Method of mounting a substrate structure to a circuit board
US5121298A (en) 1988-08-16 1992-06-09 Delco Electronics Corporation Controlled adhesion conductor
WO1991013533A1 (en) 1990-03-01 1991-09-05 Motorola, Inc. Selectively releasing conductive runner and substrate assembly
US5166774A (en) 1990-10-05 1992-11-24 Motorola, Inc. Selectively releasing conductive runner and substrate assembly having non-planar areas
US5152695A (en) 1991-10-10 1992-10-06 Amp Incorporated Surface mount electrical connector
US5994222A (en) 1996-06-24 1999-11-30 Tessera, Inc Method of making chip mountings and assemblies
US6054756A (en) 1992-07-24 2000-04-25 Tessera, Inc. Connection components with frangible leads and bus
JPH06181301A (en) * 1992-12-14 1994-06-28 Fujitsu Ltd Solid-state image sensing device
FR2704690B1 (en) * 1993-04-27 1995-06-23 Thomson Csf A method of encapsulating semiconductor chips, device obtained by this method and application to the interconnection of pellets in three dimensions.
US5786701A (en) 1993-07-02 1998-07-28 Mitel Semiconductor Limited Bare die testing
US5385477A (en) 1993-07-30 1995-01-31 Ck Technologies, Inc. Contactor with elastomer encapsulated probes
US5548091A (en) 1993-10-26 1996-08-20 Tessera, Inc. Semiconductor chip connection components with adhesives and methods for bonding to the chip
US5998864A (en) 1995-05-26 1999-12-07 Formfactor, Inc. Stacking semiconductor devices, particularly memory chips
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US6064213A (en) 1993-11-16 2000-05-16 Formfactor, Inc. Wafer-level burn-in and test
US5983493A (en) 1993-11-16 1999-11-16 Formfactor, Inc. Method of temporarily, then permanently, connecting to a semiconductor device
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US5820014A (en) 1993-11-16 1998-10-13 Form Factor, Inc. Solder preforms
US6043563A (en) 1997-05-06 2000-03-28 Formfactor, Inc. Electronic components with terminals and spring contact elements extending from areas which are remote from the terminals
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US6042712A (en) 1995-05-26 2000-03-28 Formfactor, Inc. Apparatus for controlling plating over a face of a substrate
US5806181A (en) 1993-11-16 1998-09-15 Formfactor, Inc. Contact carriers (tiles) for populating larger substrates with spring contacts
US5832601A (en) 1993-11-16 1998-11-10 Form Factor, Inc. Method of making temporary connections between electronic components
US6023103A (en) 1994-11-15 2000-02-08 Formfactor, Inc. Chip-scale carrier for semiconductor devices including mounted spring contacts
US6029344A (en) 1993-11-16 2000-02-29 Formfactor, Inc. Composite interconnection element for microelectronic components, and method of making same
US5829128A (en) 1993-11-16 1998-11-03 Formfactor, Inc. Method of mounting resilient contact structures to semiconductor devices
US5917707A (en) 1993-11-16 1999-06-29 Formfactor, Inc. Flexible contact structure with an electrically conductive shell
US5912046A (en) 1993-11-16 1999-06-15 Form Factor, Inc. Method and apparatus for applying a layer of flowable coating material to a surface of an electronic component
US5878486A (en) 1993-11-16 1999-03-09 Formfactor, Inc. Method of burning-in semiconductor devices
US5897326A (en) 1993-11-16 1999-04-27 Eldridge; Benjamin N. Method of exercising semiconductor devices
US5455390A (en) 1994-02-01 1995-10-03 Tessera, Inc. Microelectronics unit mounting with multiple lead bonding
US5416429A (en) 1994-05-23 1995-05-16 Wentworth Laboratories, Inc. Probe assembly for testing integrated circuits
US5706174A (en) 1994-07-07 1998-01-06 Tessera, Inc. Compliant microelectrionic mounting device
US5518964A (en) * 1994-07-07 1996-05-21 Tessera, Inc. Microelectronic mounting with multiple lead deformation and bonding
US5532612A (en) 1994-07-19 1996-07-02 Liang; Louis H. Methods and apparatus for test and burn-in of integrated circuit devices
US6046076A (en) 1994-12-29 2000-04-04 Tessera, Inc. Vacuum dispense method for dispensing an encapsulant and machine therefor
CN1084518C (en) 1994-12-20 2002-05-08 国际商业机器公司 Foamed polymer forming method and electric apparatus using with the same foamed polymer
GB9503953D0 (en) 1995-02-28 1995-04-19 Plessey Semiconductors Ltd An mcm-d probe tip
JP3212063B2 (en) 1995-03-08 2001-09-25 日本電信電話株式会社 Optical receptacle
JPH08264622A (en) * 1995-03-22 1996-10-11 Disco Abrasive Syst Ltd Alignment method and key-pattern detecting method
US5613861A (en) 1995-06-07 1997-03-25 Xerox Corporation Photolithographically patterned spring contact
JP3313547B2 (en) * 1995-08-30 2002-08-12 沖電気工業株式会社 Method of manufacturing a chip size package
US6007349A (en) 1996-01-04 1999-12-28 Tessera, Inc. Flexible contact post and post socket and associated methods therefor
JP2908747B2 (en) 1996-01-10 1999-06-21 ユニテクノ株式会社 Ic socket
US5977629A (en) * 1996-01-24 1999-11-02 Micron Technology, Inc. Condensed memory matrix
US5994152A (en) 1996-02-21 1999-11-30 Formfactor, Inc. Fabricating interconnects and tips using sacrificial substrates
US6001671A (en) 1996-04-18 1999-12-14 Tessera, Inc. Methods for manufacturing a semiconductor package having a sacrificial layer
US6030856A (en) 1996-06-10 2000-02-29 Tessera, Inc. Bondable compliant pads for packaging of a semiconductor chip and method therefor
US6020220A (en) 1996-07-09 2000-02-01 Tessera, Inc. Compliant semiconductor chip assemblies and methods of making same
US6050829A (en) 1996-08-28 2000-04-18 Formfactor, Inc. Making discrete power connections to a space transformer of a probe card assembly
US6075289A (en) 1996-10-24 2000-06-13 Tessera, Inc. Thermally enhanced packaged semiconductor assemblies
US6081035A (en) 1996-10-24 2000-06-27 Tessera, Inc. Microelectronic bond ribbon design
US6054337A (en) 1996-12-13 2000-04-25 Tessera, Inc. Method of making a compliant multichip package
US6049972A (en) 1997-03-04 2000-04-18 Tessera, Inc. Universal unit strip/carrier frame assembly and methods
US5994781A (en) 1997-05-30 1999-11-30 Tessera, Inc. Semiconductor chip package with dual layer terminal and lead structure
WO1999000844A2 (en) 1997-06-30 1999-01-07 Formfactor, Inc. Sockets for semiconductor devices with spring contact elements
US6045396A (en) 1997-09-12 2000-04-04 Trw Inc. Flex cable connector for cryogenic application
US6245444B1 (en) * 1997-10-02 2001-06-12 New Jersey Institute Of Technology Micromachined element and method of fabrication thereof
US6002168A (en) 1997-11-25 1999-12-14 Tessera, Inc. Microelectronic component with rigid interposer
US5944537A (en) 1997-12-15 1999-08-31 Xerox Corporation Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices
US6078186A (en) 1997-12-31 2000-06-20 Micron Technology, Inc. Force applying probe card and test system for semiconductor wafers
US6080932A (en) 1998-04-14 2000-06-27 Tessera, Inc. Semiconductor package assemblies with moisture vents
JP3536728B2 (en) * 1998-07-31 2004-06-14 セイコーエプソン株式会社 A semiconductor device and a tape carrier and methods for manufacturing thereof, a circuit board, an electronic apparatus and a tape carrier manufacturing apparatus
US6080605A (en) 1998-10-06 2000-06-27 Tessera, Inc. Methods of encapsulating a semiconductor chip using a settable encapsulant
US6063648A (en) 1998-10-29 2000-05-16 Tessera, Inc. Lead formation usings grids
US6784541B2 (en) * 2000-01-27 2004-08-31 Hitachi, Ltd. Semiconductor module and mounting method for same
WO2000073905A2 (en) * 1999-05-27 2000-12-07 Nanonexus, Inc. Test interface for electronic circuits
JP2001044226A (en) * 1999-07-27 2001-02-16 Mitsubishi Electric Corp Manufacture of semiconductor device and semiconductor device
US6827584B2 (en) 1999-12-28 2004-12-07 Formfactor, Inc. Interconnect for microelectronic structures with enhanced spring characteristics
JP2003531495A (en) * 2000-04-12 2003-10-21 フォームファクター,インコーポレイテッド Forming spring and methods of making and using thereof

Also Published As

Publication number Publication date
US6791171B2 (en) 2004-09-14
JP2004501517A (en) 2004-01-15
DE60115437T2 (en) 2006-07-27
AU6863001A (en) 2002-01-02
EP1292834A2 (en) 2003-03-19
US20020171133A1 (en) 2002-11-21
WO2001098793A3 (en) 2002-07-25
DE60115437D1 (en) 2006-01-05
EP1292834B1 (en) 2005-11-30
WO2001098793A2 (en) 2001-12-27

Similar Documents

Publication Publication Date Title
DE60227163D1 (en) test device
DE60043049D1 (en) Blood test device
DE69928414D1 (en) 4-aminopyrrolopyrimidine as kinase inhibitors
DE60132310D1 (en) Velcro system
DE59913706D1 (en) Protection circuit for an integrated circuit
DE60017180D1 (en) Fab I inhibitors
DE69938585D1 (en) Integrated circuitry
NO20012866L (en) Amplifier circuit
DE60136660D1 (en) electronic sphygmomanometer
DE60143164D1 (en) N and related procedures
NO20025370L (en) Right X kromosomb¶rende and Y kromosomb¶rende populations of s¶dceller
DE60028482D1 (en) navigation device
DE60045492D1 (en) navigation device
DE60137685D1 (en) Programmatic masking of storage units
DE69935741D1 (en) Completion of vacuum-holes
DE60133164D1 (en) Map display method
NO20014970D0 (en) Cyclic protein tyrosine kinase inhibitor
NO996359D0 (en) Circuit System for Timing and delay circuits
DE60044187D1 (en) navigation device
ID29945A (en) Mixtures of carbohydrates
AT390082T (en) Blood analyzer
DE60218932D1 (en) Integrated circuit structure
AT298445T (en) Metallabgeschirmtes electronic award system
DE69832985D1 (en) Multiply-accumulator circuits
DE60138933D1 (en) System and method for testing integrated circuits

Legal Events

Date Code Title Description
RER Ceased as to paragraph 5 lit. 3 law introducing patent treaties