AT146644T - Laminary plate for producing printed circuits, printed circuit made thereof and method for their production - Google Patents

Laminary plate for producing printed circuits, printed circuit made thereof and method for their production

Info

Publication number
AT146644T
AT146644T AT94830005T AT94830005T AT146644T AT 146644 T AT146644 T AT 146644T AT 94830005 T AT94830005 T AT 94830005T AT 94830005 T AT94830005 T AT 94830005T AT 146644 T AT146644 T AT 146644T
Authority
AT
Austria
Prior art keywords
laminary
production
plate
printed circuit
producing
Prior art date
Application number
AT94830005T
Other languages
German (de)
Inventor
Antonio Canova
Original Assignee
Magnetek Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Magnetek Spa filed Critical Magnetek Spa
Priority to EP19940830005 priority Critical patent/EP0667736B1/en
Publication of AT146644T publication Critical patent/AT146644T/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/05Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203Cooling of mounted components
    • H05K1/0204Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0335Layered conductors or foils
    • H05K2201/0355Metal foils
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03Conductive materials
    • H05K2201/0332Structure of the conductor
    • H05K2201/0364Conductor shape
    • H05K2201/0382Continuously deformed conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09Shape and layout
    • H05K2201/09009Substrate related
    • H05K2201/09054Raised area or protrusion of metal substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10166Transistor
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06Lamination
    • H05K2203/063Lamination of preperforated insulating layer
AT94830005T 1994-01-12 1994-01-12 Laminary plate for producing printed circuits, printed circuit made thereof and method for their production AT146644T (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP19940830005 EP0667736B1 (en) 1994-01-12 1994-01-12 Laminar board for the production of printed circuits, printed circuit made with the said board, and method for its fabrication

Publications (1)

Publication Number Publication Date
AT146644T true AT146644T (en) 1997-01-15

Family

ID=8218363

Family Applications (1)

Application Number Title Priority Date Filing Date
AT94830005T AT146644T (en) 1994-01-12 1994-01-12 Laminary plate for producing printed circuits, printed circuit made thereof and method for their production

Country Status (6)

Country Link
US (1) US5523919A (en)
EP (1) EP0667736B1 (en)
AT (1) AT146644T (en)
CA (1) CA2139824A1 (en)
DE (1) DE69401195T2 (en)
ES (1) ES2095733T3 (en)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2742294B1 (en) * 1995-12-11 1998-02-27 Valeo Electronique Electronic thermal drain assembly, in particular for a high voltage transformer of a motor vehicle projector discharge lamp
US5812375A (en) * 1996-05-06 1998-09-22 Cummins Engine Company, Inc. Electronic assembly for selective heat sinking and two-sided component attachment
DE19750306A1 (en) * 1997-11-13 1999-05-20 Bosch Gmbh Robert Electronic control device for motor vehicle
DE19805492C2 (en) * 1998-02-11 1999-12-02 Siemens Ag Circuit board
FR2801763B1 (en) * 1999-11-30 2002-02-15 Sagem Electronic power module and method for manufacturing such a module
DE10048243A1 (en) * 2000-09-29 2002-04-18 Bosch Gmbh Robert Smoothed surface substrate and process for its manufacture
JP2003289191A (en) * 2002-03-28 2003-10-10 Denso Corp Electronic control device
US8068346B2 (en) * 2004-05-04 2011-11-29 Hamilton Sundstrand Corporation Circuit board with high density power semiconductors
US20080158821A1 (en) * 2004-11-30 2008-07-03 Telefonaktiebolaget Lm Ericsson (Publ) Printed Board Assembly with Improved Heat Dissipation
DE102009051632A1 (en) * 2009-11-02 2011-05-05 Beru Ag Printed circuit board for glow plug control device, has cooling body designed as metal plate, which carries board and exhibits projections that are engaged or pressed into recess of board, where projections carry electronic components
US20110272179A1 (en) * 2010-05-06 2011-11-10 Vasoya Kalu K Printed Circuit Board with Embossed Hollow Heatsink Pad
TWI435666B (en) * 2010-07-20 2014-04-21 Lg Innotek Co Ltd Radiant heat circuit board and method for manufacturing the same
DE102013000169A1 (en) * 2013-01-09 2014-07-10 Carl Freudenberg Kg Arrangement with a flexible printed circuit board
US9883580B1 (en) 2014-04-11 2018-01-30 Adura Led Solutions, Llc Printed circuit board that provides a direct thermal path between components and a thermal layer and method for assembly
TWI544868B (en) * 2014-07-11 2016-08-01 台達電子工業股份有限公司 Heat dissipation module and assembling method thereof
JP2016025229A (en) * 2014-07-22 2016-02-08 株式会社オートネットワーク技術研究所 Circuit structure
JP6287659B2 (en) * 2014-07-22 2018-03-07 株式会社オートネットワーク技術研究所 Circuit structure
JP6287815B2 (en) * 2014-12-24 2018-03-07 株式会社オートネットワーク技術研究所 Method for manufacturing circuit structure

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3165672A (en) * 1959-06-15 1965-01-12 Burroughs Corp Printed circuit baseboard
GB1217148A (en) * 1967-07-13 1970-12-31 Nat Res Dev Improvements in or relating to substrates for microelectronic components
FR2615347B1 (en) * 1987-05-15 1993-07-23 Neiman Sa Power module for automotive equipment
DE3829117A1 (en) * 1988-08-27 1990-03-08 Standard Elektrik Lorenz Ag Metal core printed circuit board
JPH03273465A (en) * 1990-03-23 1991-12-04 Yokogawa Electric Corp Wireless type charge paying device of charge prepayment system and portable medium
JPH0451597A (en) * 1990-06-20 1992-02-20 Hitachi Ltd Heat-dissipating type high-density printed wiring board
US5220487A (en) * 1992-01-27 1993-06-15 International Business Machines Corporation Electronic package with enhanced heat sinking
DE4232575A1 (en) * 1992-09-29 1994-03-31 Bosch Gmbh Robert Arrangement with a printed circuit board, at least one power component and a heat sink

Also Published As

Publication number Publication date
DE69401195D1 (en) 1997-01-30
DE69401195T2 (en) 1997-07-03
EP0667736A1 (en) 1995-08-16
ES2095733T3 (en) 1997-02-16
US5523919A (en) 1996-06-04
EP0667736B1 (en) 1996-12-18
CA2139824A1 (en) 1995-07-13

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Legal Events

Date Code Title Description
UEP Publication of translation of european patent specification
REN Ceased due to non-payment of the annual fee