AR003338A1 - Cuerpo refrigerante - Google Patents
Cuerpo refrigeranteInfo
- Publication number
- AR003338A1 AR003338A1 ARP960104087A AR10408796A AR003338A1 AR 003338 A1 AR003338 A1 AR 003338A1 AR P960104087 A ARP960104087 A AR P960104087A AR 10408796 A AR10408796 A AR 10408796A AR 003338 A1 AR003338 A1 AR 003338A1
- Authority
- AR
- Argentina
- Prior art keywords
- cooling body
- meander
- tape
- constructive
- sit
- Prior art date
Links
- 238000001816 cooling Methods 0.000 abstract 3
- 229910001369 Brass Inorganic materials 0.000 abstract 1
- 239000010951 brass Substances 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 230000008878 coupling Effects 0.000 abstract 1
- 238000010168 coupling process Methods 0.000 abstract 1
- 238000005859 coupling reaction Methods 0.000 abstract 1
- 230000017525 heat dissipation Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Se representa un cuerpo refrigerante para elementos constructivos electrónicos en una sola pieza, consistente en una cinta de chapa de latón.Esta cinta se dobla en forma de meandro, donde las superficies de contacto (2) ubicadas en elsect or inferior de los arcos de meandro (11) asientan sobre undistribuidor de calor (8) de un elemento constructivo (9). El cuerpo refrigerante se sujeta sobre el elemento constructivo (9) mediante una fuerzade pretensado generadainternamente combinada con un acople a resorte. A pesar de que el cuerpo refrigerante (1) también presenta en el estado de montado unaelasticidad longitudinal, su función disipadora de calor se puede mantener permanentemente.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19531628A DE19531628C2 (de) | 1995-08-28 | 1995-08-28 | Kühlkörper |
Publications (1)
Publication Number | Publication Date |
---|---|
AR003338A1 true AR003338A1 (es) | 1998-07-08 |
Family
ID=7770592
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ARP960104087A AR003338A1 (es) | 1995-08-28 | 1996-08-23 | Cuerpo refrigerante |
Country Status (12)
Country | Link |
---|---|
US (1) | US5893409A (es) |
EP (1) | EP0847595B1 (es) |
CN (1) | CN1114944C (es) |
AR (1) | AR003338A1 (es) |
AT (1) | ATE282249T1 (es) |
BR (1) | BR9610014A (es) |
DE (2) | DE19531628C2 (es) |
ES (1) | ES2227608T3 (es) |
IN (1) | IN188906B (es) |
PT (1) | PT847595E (es) |
RU (1) | RU2152667C1 (es) |
WO (1) | WO1997008750A1 (es) |
Families Citing this family (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6269863B1 (en) * | 1998-10-09 | 2001-08-07 | Molex Incorporated | Integrated processor mounting mechanism and heat sink |
US6093961A (en) * | 1999-02-24 | 2000-07-25 | Chip Coolers, Inc. | Heat sink assembly manufactured of thermally conductive polymer material with insert molded metal attachment |
US6191478B1 (en) * | 1999-06-07 | 2001-02-20 | Agilent Technologies Inc. | Demountable heat spreader and high reliability flip chip package assembly |
US6304449B1 (en) * | 1999-07-06 | 2001-10-16 | Chaojiong Zhang | Heat sink mounting for power semiconductors |
US6208517B1 (en) | 1999-09-10 | 2001-03-27 | Legerity, Inc. | Heat sink |
TW547699U (en) * | 2000-06-14 | 2003-08-11 | Foxconn Prec Components Co Ltd | Heat sink device |
US20020041481A1 (en) * | 2000-09-28 | 2002-04-11 | Yoshinori Kano | Linear motor and electronic component feeding apparatus |
US6445583B1 (en) | 2001-01-26 | 2002-09-03 | Laird Technologies, Inc. | Snap in heat sink shielding lid |
EP1341230A1 (en) * | 2002-02-27 | 2003-09-03 | Spark Electronic S.R.L. | Heat dissipator for integrated circuits |
US6639803B1 (en) | 2002-07-11 | 2003-10-28 | International Business Machines Corporation | Compliant heat sink device/mounting system interconnect and a method of implementing same |
DE102005001748B4 (de) * | 2005-01-14 | 2019-01-24 | Marquardt Gmbh | Elektrischer Schalter und Elektrohandwerkzeug mit einem solchen Schalter |
DE102005002812B4 (de) * | 2005-01-20 | 2013-07-18 | Infineon Technologies Ag | Kühlkörper für oberflächenmontierte Halbleiterbauteile und Montageverfahren |
DE102005012216B4 (de) * | 2005-03-15 | 2008-11-13 | Infineon Technologies Ag | Oberflächenmontiertes Halbleiterbauteil mit Kühlkörper und Montageverfahren |
DE102005040856B4 (de) * | 2005-08-29 | 2012-03-29 | Siemens Ag | Drehkolbenstrahler |
US7262369B1 (en) | 2006-03-09 | 2007-08-28 | Laird Technologies, Inc. | Combined board level EMI shielding and thermal management |
US20080080160A1 (en) * | 2005-12-16 | 2008-04-03 | Laird Technologies, Inc. | Emi shielding assemblies |
US7623360B2 (en) * | 2006-03-09 | 2009-11-24 | Laird Technologies, Inc. | EMI shielding and thermal management assemblies including frames and covers with multi-position latching |
US7317618B2 (en) * | 2006-03-09 | 2008-01-08 | Laird Technologies, Inc. | Combined board level shielding and thermal management |
US7463496B2 (en) * | 2006-03-09 | 2008-12-09 | Laird Technologies, Inc. | Low-profile board level EMI shielding and thermal management apparatus and spring clips for use therewith |
US20080310119A1 (en) * | 2007-06-13 | 2008-12-18 | Tellabs Bedford, Inc. | Clip on heat sink |
DE102007054856A1 (de) * | 2007-11-16 | 2009-05-20 | Osram Gesellschaft mit beschränkter Haftung | Beleuchtungsvorrichtung mit einer Substratplatte und einem Kühlkörper |
US7965514B2 (en) | 2009-06-05 | 2011-06-21 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US8477499B2 (en) | 2009-06-05 | 2013-07-02 | Laird Technologies, Inc. | Assemblies and methods for dissipating heat from handheld electronic devices |
US20110216506A1 (en) * | 2010-03-02 | 2011-09-08 | Malico Inc. | Heat sink buckle |
DE102012112393B4 (de) * | 2012-12-17 | 2018-05-03 | Phoenix Contact Gmbh & Co. Kg | Elektrische Baugruppe |
CN105790787B (zh) * | 2016-02-25 | 2018-03-02 | 广东欧珀移动通信有限公司 | 阻抗匹配电路的设计方法及移动终端 |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1922618U (de) * | 1965-06-12 | 1965-09-02 | Daut & Co K G | Vorrichtung zum kuehlen von transistoren. |
US3670215A (en) * | 1970-09-28 | 1972-06-13 | Staver Co Inc The | Heat dissipator for integrated circuit |
DE2216162A1 (de) * | 1972-04-04 | 1973-10-11 | Staver Co | Kuehlkoerper fuer eine halbleitereinrichtung |
DE3203609C2 (de) * | 1982-02-03 | 1985-02-14 | Siemens AG, 1000 Berlin und 8000 München | Kühlelement für integrierte Bauelemente |
US4605058A (en) * | 1985-04-01 | 1986-08-12 | The Staver Company, Inc. | Heat dissipating retainer for electronic package |
US4945401A (en) * | 1987-07-20 | 1990-07-31 | The Staver Company Inc. | Heat dissipator for semiconductor unit |
GB2237682A (en) * | 1989-09-28 | 1991-05-08 | Redpoint Limited | Heatsink for semiconductor devices |
JPH0410558A (ja) * | 1990-04-27 | 1992-01-14 | Hitachi Ltd | 放熱体付き半導体装置 |
DE4335299A1 (de) * | 1993-10-15 | 1995-04-20 | Siemens Ag | Kühlkörper mit integrierter Befestigung |
-
1995
- 1995-08-28 DE DE19531628A patent/DE19531628C2/de not_active Expired - Fee Related
-
1996
- 1996-08-06 US US09/029,173 patent/US5893409A/en not_active Expired - Lifetime
- 1996-08-06 WO PCT/DE1996/001469 patent/WO1997008750A1/de active IP Right Grant
- 1996-08-06 CN CN96196649A patent/CN1114944C/zh not_active Expired - Fee Related
- 1996-08-06 EP EP96934338A patent/EP0847595B1/de not_active Expired - Lifetime
- 1996-08-06 DE DE59611144T patent/DE59611144D1/de not_active Expired - Lifetime
- 1996-08-06 AT AT96934338T patent/ATE282249T1/de active
- 1996-08-06 BR BR9610014A patent/BR9610014A/pt not_active IP Right Cessation
- 1996-08-06 RU RU98105616/28A patent/RU2152667C1/ru not_active IP Right Cessation
- 1996-08-06 ES ES96934338T patent/ES2227608T3/es not_active Expired - Lifetime
- 1996-08-06 PT PT96934338T patent/PT847595E/pt unknown
- 1996-08-12 IN IN1440CA1996 patent/IN188906B/en unknown
- 1996-08-23 AR ARP960104087A patent/AR003338A1/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP0847595A1 (de) | 1998-06-17 |
CN1194724A (zh) | 1998-09-30 |
IN188906B (es) | 2002-11-16 |
BR9610014A (pt) | 1999-07-06 |
DE19531628A1 (de) | 1997-03-06 |
EP0847595B1 (de) | 2004-11-10 |
RU2152667C1 (ru) | 2000-07-10 |
US5893409A (en) | 1999-04-13 |
WO1997008750A1 (de) | 1997-03-06 |
ES2227608T3 (es) | 2005-04-01 |
DE59611144D1 (de) | 2004-12-16 |
PT847595E (pt) | 2005-02-28 |
CN1114944C (zh) | 2003-07-16 |
ATE282249T1 (de) | 2004-11-15 |
DE19531628C2 (de) | 1999-08-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AR003338A1 (es) | Cuerpo refrigerante | |
DE69534968D1 (de) | Halbleiteranordnungen vom Druckkontakttyp | |
FI964060A0 (fi) | Kosketusjousi | |
DE59703185D1 (de) | Einstückige Kontaktfeder | |
DE59105038D1 (de) | Kontaktstift-Kontaktfederbuchsen-Baueinheit. | |
DE50313409D1 (de) | Hermaphroditisches Kontaktteil | |
DE50103639D1 (de) | Profilleiste | |
DE59404834D1 (de) | Stellantrieb mit Federrücklauf | |
ES2155195T3 (es) | Patin de rozamiento para pantografos de toma de corriente y procedimiento para su fabricacion. | |
PT1061623E (pt) | Caleira para cabos | |
CA2344863A1 (en) | Elongate light source | |
DE50102452D1 (de) | Klemmkörper | |
ES2183768T3 (es) | Dispositivo de insercion de muelle de sujecion. | |
SE8901957L (sv) | Lamphaallare | |
BR0111959A (pt) | Elemento de fixação aperfeiçoado | |
DE69635946D1 (de) | Halbleiteranordnung vom Druckkontakttyp | |
DE502005006801D1 (de) | Thermomanometer | |
ES2164322T3 (es) | Dispositivo de conmutacion para conexiones entre circuitos electricos. | |
ATE263343T1 (de) | Verdampfer für einen kühlschrank oder dergleichen | |
ES2088777T1 (es) | Dispositivo adaptador para termopares | |
ES2079189T3 (es) | Nucleo de bobina con contacto a masa. | |
AR247777A1 (es) | Elemento de cierre para fijar con tolerancia axial una parte de carcasa sobre un cuerpo de base | |
KR960022112U (ko) | 인라인밸브 스프링장치 | |
IT1295767B1 (it) | Valvola termostatica e relativo metodo di montaggio. | |
DE59106145D1 (de) | Federkontaktstift. |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FG | Grant, registration |