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("HIGH-TRANSPARENCY SEMICONDUCTOR-METAL INTERFACES");
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High-transparency semiconductor-metal interfaces

Priority 2020-11-04 • Filed 2020-11-04 • Granted 2024-09-17 • Published 2024-09-17

Techniques that can facilitate high-transparency semiconductor-metal interfaces are provided. In one example, a method can comprise forming a silicon on insulator (SOI) over a wafer. The method can further comprise depositing a metal on the SOI. The method can further comprise forming a structure …
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