WO2009087908A1 - 有用金属のリサイクル方法 - Google Patents
有用金属のリサイクル方法 Download PDFInfo
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- WO2009087908A1 WO2009087908A1 PCT/JP2008/073572 JP2008073572W WO2009087908A1 WO 2009087908 A1 WO2009087908 A1 WO 2009087908A1 JP 2008073572 W JP2008073572 W JP 2008073572W WO 2009087908 A1 WO2009087908 A1 WO 2009087908A1
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B7/00—Working up raw materials other than ores, e.g. scrap, to produce non-ferrous metals and compounds thereof; Methods of a general interest or applied to the winning of more than two metals
- C22B7/006—Wet processes
- C22B7/007—Wet processes by acid leaching
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/04—Extraction of metal compounds from ores or concentrates by wet processes by leaching
- C22B3/06—Extraction of metal compounds from ores or concentrates by wet processes by leaching in inorganic acid solutions, e.g. with acids generated in situ; in inorganic salt solutions other than ammonium salt solutions
- C22B3/10—Hydrochloric acid, other halogenated acids or salts thereof
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B3/00—Extraction of metal compounds from ores or concentrates by wet processes
- C22B3/20—Treatment or purification of solutions, e.g. obtained by leaching
- C22B3/22—Treatment or purification of solutions, e.g. obtained by leaching by physical processes, e.g. by filtration, by magnetic means, or by thermal decomposition
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22B—PRODUCTION AND REFINING OF METALS; PRETREATMENT OF RAW MATERIALS
- C22B58/00—Obtaining gallium or indium
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C1/00—Electrolytic production, recovery or refining of metals by electrolysis of solutions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25C—PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY OR REFINING OF METALS; APPARATUS THEREFOR
- C25C5/00—Electrolytic production, recovery or refining of metal powders or porous metal masses
- C25C5/04—Electrolytic production, recovery or refining of metal powders or porous metal masses from melts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J9/00—Apparatus or processes specially adapted for the manufacture, installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps
- H01J9/52—Recovery of material from discharge tubes or lamps
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2203/00—Function characteristic
- G02F2203/68—Green display, e.g. recycling, reduction of harmful substances
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Definitions
- the present invention relates to a method for recycling useful metals from waste such as a waste flat panel display, a waste cathode ray tube, a waste fluorescent tube, a waste integrated circuit, and a waste printed circuit board.
- an expensive rare metal such as indium is used for a transparent electrode (ITO: Indium Tin Oxide) made of a compound of indium oxide (In 2 O 3 ) and tin oxide (SnO 2 ).
- ITO Indium Tin Oxide
- rare earth metal oxides are frequently used for fluorescent materials that convert ultraviolet light or electron beam energy into visible light.
- the cathode ray tube and the fluorescent tube contain lead (Pb) and antimony (Sb), and a large amount of silver (Ag) is used for the electromagnetic wave shielding mesh of the plasma display panel.
- the conventional solder contains lead (Pb) and zinc (Zn), and the recent lead-free solder (lead-free solder) includes silver (Ag), tin (Sn), copper (Cu) and the like are included.
- Zn zinc
- ZnO zinc oxide
- lead (Pb) is frequently used for electrodes of lead-acid batteries (secondary batteries)
- antimony (Sb) is frequently used for aluminum alloy additives, bearing alloys, semiconductor additives, and the like.
- Patent Document 1 collects In (indium) and Ag (silver), which are valuable metals attached to the panel surface as electrode materials, from waste products of flat panel displays such as liquid crystal display panels and plasma displays,
- the present invention relates to a recycling system for valuable metals to be reused.
- Patent Document 1 As shown in FIG. 1, a ground flat panel display that has been crushed or disassembled is immersed in an HCl solution, the solution is filtered, and separated into a solution containing In and a residue containing Ag. , In is extracted, the In-containing solution is concentrated, a solution is prepared so as to have a predetermined In concentration, and this solution is spray-coated on the substrate, thereby forming a transparent film on the substrate. Further, In is recovered by electrolyzing the extracted In-containing solution.
- the Ag-containing residue is immersed in HNO 3 or heated H 2 SO 4 solution, dissolved and filtered to obtain a solution containing Ag, and KCl or NaCl is added to the Ag-containing solution. Is recovered as a solution, and this AgCl solution is burned and recovered as Ag. Further, Ag is recovered by electrolyzing an Ag-containing solution formed by immersing a residue containing Ag in HNO 3 or heated H 2 SO 4 solution, dissolving and filtering the Ag-containing solution. Furthermore, an Ag-containing solution formed by immersing the Ag-containing residue in a Na 2 S 2 O 3 solution and dissolving / filtering is electrolyzed or allowed to stand to recover Ag 2 S.
- Patent Document 1 the ground flat panel display that has been crushed or disassembled is further immersed and filtered in an HNO 3 solution to separate into a solution containing In and Ag and a residue, and In and Ag are extracted.
- NaCl is added to obtain an In-containing solution.
- AgCl precipitates are collected.
- the extracted In-containing solution is concentrated to prepare a solution so as to have a predetermined In concentration, and spray coating is performed on the substrate to form a transparent film on the substrate.
- In is recovered by electrolyzing the extracted In-containing solution.
- the recovered AgCl is burned and recovered as Ag.
- Patent Document 2 relates to an economical waste liquid crystal panel processing method that can be ideally recycled with little waste and that is simple and has a large processing capacity.
- a glass substrate of a liquid crystal panel is sorted according to the type of glass using fluorescent X-rays, an organic substance contained in the liquid crystal panel is burned and removed, and a film formed on the glass substrate is mechanically removed. It is removed and collected as metal powder. Moreover, the glass substrate is crushed as a pre-process of a film
- Patent Document 3 relates to an economical method for treating a waste liquid crystal panel that can be ideally recycled with little waste.
- the liquid crystal panel is cut with the polarizing plate and the liquid crystal is collected. Further, after removing the polarizing plate from the liquid crystal panel, the liquid crystal panel is cut to recover the liquid crystal. At this time, the glass substrate of the liquid crystal panel is cut without cutting the sealing material enclosing the liquid crystal.
- a method for dissolving and recovering liquid crystal using a solvent, and a method for scraping and recovering liquid crystal are disclosed.
- the recovery of the film formed on the cut glass substrate uses a method of mechanically peeling or a method of immersing the cut glass substrate in concentrated sulfuric acid.
- Patent Document 4 relates to an economical method for treating a waste liquid crystal panel that can be ideally recycled with little waste.
- the polarizing plate is peeled off from the liquid crystal panel, the glass substrate of the liquid crystal panel is cut, the liquid crystal is recovered, and the cut glass substrate is sorted by glass type.
- the thin film formed on the glass substrate is mechanically removed and collected.
- the panel cutting step the glass substrate is cut without cutting the sealing material enclosing the liquid crystal.
- a method of performing a panel cutting step after peeling off the polarizing plate is also disclosed.
- a method using a solvent or a method of scraping the liquid crystal is used for recovering the liquid crystal. Fluorescent X-rays are used for selecting the glass type, and a method of crushing a glass substrate selected for each glass type is used as a pre-process of the thin film removing process.
- the thin film on the glass substrate is mechanically peeled off and collected, and metals such as indium and chromium are collected from the thin film.
- Patent Document 5 relates to an economical method for treating a waste liquid crystal panel, in which glass substrates, liquid crystals, and the like are collected and reused, and can be ideally recycled with little waste. .
- the polarizing plate is peeled off from the liquid crystal panel, and after the glass substrate of the liquid crystal panel is cut, the cut glass substrate is chamfered, and the cut glass substrate is sorted according to the type of glass and cut.
- the thin film formed on the glass substrate is removed and collected.
- the method of performing a panel cutting process after performing polarizing plate peeling is also disclosed.
- a method of cutting the glass substrate without cutting the sealing material enclosing the liquid crystal is also used.
- fluorescent X-rays are used for the selection of the glass substrate.
- removing the thin film a method of removing the organic substance contained in the cut glass substrate by removing the thin film by etching and / or polishing is also disclosed.
- a method of immersing a glass substrate in concentrated sulfuric acid or a strong alkaline solution is disclosed for removing residual organic substances.
- a method of recovering the liquid crystal after cutting the panel is also disclosed, and a method using a solvent that dissolves the liquid crystal or a method of scraping the liquid crystal is used.
- metals such as indium and chromium can be recovered from the thin film.
- Patent Document 6 relates to a low-cost and environmentally friendly plasma display panel in which a transparent electrode is made of an ITO alternative material.
- the transparent electrode constituting the display electrode of the plasma display panel is made of a material mainly composed of zinc oxide, and the component of the dielectric layer formed so as to cover the transparent electrode.
- a material mainly composed of zinc oxide is used for the use of zinc oxide.
- Patent Document 7 relates to a color filter for a liquid crystal display in which cracks and peeling are unlikely to occur in a liquid crystal driving transparent electrode.
- Patent Document 7 is composed of an amorphous oxide containing zinc element and indium element as the main cation element of the liquid crystal driving transparent electrode of the liquid crystal display, and the atomic ratio Zn between the zinc element and the indium element is Zn. It is disclosed that / (Zn + In) is 0.1 or more and less than 0.2. JP 2000-335915 A
- Patent Document 8 relates to a method and a system for recovering a glass material with low energy consumption and free from impurities such as metals and metal oxides at low cost.
- Patent Document 8 is an invention by one of the inventors of the present invention.
- a waste glass material containing silicon oxide as a main component and containing metal and / or metal oxide as an impurity is brought into a hydrofluoric acid aqueous solution and saturated. It is dissolved in a solution containing fluorine ions such as an aqueous solution of hydrofluoric acid or a mixture thereof, and after passing through a saturated state and a supersaturated state, a supersaturated additive is added to the solution in which the glass material is dissolved to precipitate silicon oxide. .
- the obtained silicon oxide is used in any atmosphere selected from an inert gas, a reducing gas, water vapor, a mixed gas of an inert gas and a reducing gas, and a mixed gas of an inert gas and water vapor.
- a method for heat treatment is disclosed.
- a system for recovering glass material from waste glass is disclosed. JP 2001-274116 A
- Patent Document 9 relates to a copper plating solution for forming a high-purity copper thin film without requiring a special reducing agent.
- the present invention also relates to a method for forming a copper multilayer wiring structure using the copper plating solution.
- This patent document 9 is an invention by one of the inventors of the present invention, and is made of an aqueous solution in which a copper ion source such as copper oxide or copper hydroxide is dissolved in hydrofluoric acid and / or silicohydrofluoric acid.
- a copper ion source such as copper oxide or copper hydroxide is dissolved in hydrofluoric acid and / or silicohydrofluoric acid.
- the invention described in this Patent Document 10 does not require the formation of a copper seed layer, and is a prior art in an electrolytic copper plating method using a copper plating solution for forming a copper plating film directly on the TaN barrier film and an acidic copper sulfate plating solution. It relates to a processing solution.
- the present invention also relates to a method for forming a copper multilayer wiring structure using these plating solution and pretreatment solution.
- This Patent Document 10 is an invention including one of the inventors of the present invention, and the copper plating solution and the copper plating pretreatment solution contain hydrofluoric acid and / or silicohydrofluoric acid containing copper ions.
- a main component at least one of a titanium compound and a polyhydric alcohol is added as an additive.
- the method of performing electroless copper plating pretreatment and / or electrolytic copper plating pretreatment using the copper plating pretreatment solution is disclosed. JP 2000-17464 A
- Patent Document 11 recovers and regenerates the copper chloride etching waste liquid generated in the etching tank, and then supplies it to the plating work again, thereby reducing the raw material cost and reducing the environmental pollution problem.
- the present invention relates to an etching waste liquid recycling method and apparatus.
- a copper chloride etching waste liquid generated in an etching tank is collected, reacted with sodium hydroxide to produce copper hydroxide, and thermally decomposed at a temperature of 80 ° C. or higher to produce solid copper oxide.
- a copper chloride etching waste liquid generated in an etching tank is collected, reacted with sodium hydroxide to produce copper hydroxide, and thermally decomposed at a temperature of 80 ° C. or higher to produce solid copper oxide.
- it is dissolved with sulfuric acid to form a copper ion-containing electrolyte, which is transported into a plating tank and electroplated using a titanium metal electrode.
- a recycling method is disclosed.
- Patent Document 11 a copper chloride etching waste liquid recovery unit, a sodium hydroxide supply unit, a copper chloride etching waste liquid and sodium hydroxide reaction unit, a dehydration unit, a storage space for dried copper oxide, a dissociation unit, an electrolysis unit
- An etching waste liquid recycling apparatus including a liquid inlet, an electroplating residual liquid outlet, an electroplating unit, and the like is disclosed. JP 2003-293048 A
- Patent Document 12 relates to a method for recycling copper and nickel in large quantities and at low cost without separating and removing the copper component from the resin plating waste material in which the copper plating film and the nickel plating film are mixed. is there.
- Patent Document 12 a metal component-enriched mixture forming step for increasing the abundance ratio of a plating film component of a resin plating waste material having a copper plating film and a nickel plating film formed on the surface of a resin base material, and then the mixture
- the metal component recovery method of the resin plating waste material which has the metal component recovery process which heat-dissolves and obtains the alloy containing copper and nickel is disclosed.
- the metal component-enriched mixture forming step includes either a method of reducing the resin base material component, a method of increasing the metal component, or a method of reducing the resin base material component and increasing the metal component. The method used is disclosed.
- an alloy such as a Cu—Ni alloy or an Al—Cu—Ni—Cr alloy is obtained in the metal component recovery step. JP 2000-348698 A
- Patent Document 13 relates to a sealed lead-acid battery that reduces man-hours during assembly and has excellent separation and recovery during recycling, and a method for manufacturing the same.
- Patent Document 14 relates to a lead separation method that makes it easy to dispose of and recycle a sample by separating the lead from a sample to which lead is attached.
- Patent Document 14 separates lead from lead solder using an acid such as hydrochloric acid and acetic acid, a solvent such as methanol, ethanol and ethylene glycol, and a lead separation solution prepared by dissolving iodine.
- an acid such as hydrochloric acid and acetic acid
- a solvent such as methanol, ethanol and ethylene glycol
- a lead separation solution prepared by dissolving iodine.
- This Non-Patent Document 1 is an academic conference including one of the inventors of the present invention, and discloses the result of examining the possibility of separation for each metal element by cyclic voltammetry.
- Lead oxide (PbO) and iron oxide (III) (Fe 2 O 3 ) are individually dissolved in a hydrofluoric acid (HF) aqueous solution, platinum (Pt) is used as an electrode, and current- The result of examining the voltage characteristics is disclosed.
- HF hydrofluoric acid
- Pt platinum
- current- The result of examining the voltage characteristics is disclosed.
- Pb and Fe are likely to be separated as PbF 2 and Fe 2 O 3 , respectively.
- This Non-Patent Document 2 is a conference presentation that includes one of the inventors of the present invention. Fluorine-added oxidation using an aqueous solution in which a glass powder having the same composition as the CRT glass is dissolved in an aqueous hydrofluoric acid (HF) solution. A result of forming a silicon (SiOF) thin film and performing characteristic evaluation is disclosed. Silica (SiO 2 ), lead oxide (PbO), barium oxide (BaO), strontium oxide (SrO), etc. are prepared in the same composition as CRT glass, dissolved in an HF aqueous solution, and hydrofluoric acid (H 2 SiF 6 ). An aqueous solution is prepared, a supersaturated additive Al is added, the silicon substrate is immersed, and a SiOF thin film is deposited.
- HF hydrofluoric acid
- HCl is used without using aqua regia mainly composed of HCl and HNO 3 which are generally used for melting and processing ITO.
- Metal oxides such as indium oxide (In 2 O 3 ) have a problem that the dissolution rate in HCl is slow. Another problem is that other metals used for wiring and the like are dissolved.
- Patent Documents 2 to 5 focus on recycling of glass substrates, and do not specifically disclose a method for separating and collecting metals such as indium.
- Patent Documents 6 and 7 disclose the use of zinc oxide, but do not disclose a method for recycling zinc.
- Patent Document 8 discloses a method of separating silica glass from a metal oxide or metal fluoride and recycling the silica glass. However, a method of recycling metal from the metal oxide or metal fluoride is disclosed. Not.
- Patent Document 9 copper oxide or copper hydroxide is dissolved in a hydrofluoric acid aqueous solution or a silicohydrofluoric acid aqueous solution, but there is a problem that metallic copper is insoluble in these aqueous solutions.
- patent document 10 like patent document 9, although copper oxide and copper hydroxide are melt
- Patent Document 11 relates to recycling of a plating solution for copper chloride plating and a method of performing copper plating again, which is completely different from the object and method of the present invention.
- Patent Document 12 alloys such as Cu—Ni alloy and Al—Cu—Ni—Cr alloy can be obtained, but there is a problem that it is difficult to collect Cu alone.
- Patent Document 13 provides a sealed lead-acid battery excellent in separation and recovery at the time of recycling and a manufacturing method thereof.
- Patent Document 14 describes lead that separates lead to facilitate sample disposal / recycling. A separation method is provided. None of them disclose the recycling of lead itself.
- Non-Patent Document 1 and Non-Patent Document 2 merely suggest the possibility of separation and recovery of useful metal elements, and are not disclosed at all.
- the object of the present invention is to solve the above-mentioned problems of the prior art and to provide a waste flat panel display, a waste cathode ray tube, a waste fluorescent tube, a waste integrated circuit, a waste printed circuit board and other waste materials, or an in-vehicle copper wiring harness and a power cable.
- wastes such as transmission and distribution lines, coaxial cables, parallel bilinear feeders, etc. or metals for transparent electrode oxides such as indium and zinc simultaneously from multiple kinds, such as yttrium, europium, terbium, gadolinium, etc.
- the useful metal recycling method of the present invention includes a waste flat panel display, a waste cathode ray tube, a waste fluorescent tube, a waste integrated circuit, a waste printed circuit board, a waste solar panel, or an in-vehicle copper wiring harness, a power cable, a power transmission and distribution line, Simultaneously pulverize and pulverize one or more types of waste products such as coaxial cables, parallel bilinear feeders, and other copper wiring, simultaneously into an aqueous solution containing HF as the main component, and at room temperature. It can be dissolved at a certain temperature.
- the redox potentials of In, Sn, Zn, Eu, Tb, Gd, Sb, Pb, and Ag are -0.534V, -0.336V, -0. Since it is different from 959V, -2.186V, -2.496V, -2.486V, 0.014V, -0.322V, 0.603V, it can be separated and collected by metal by controlling the voltage during electrolysis. Is possible. Furthermore, after being deposited as an alloy of these useful metals by electrolysis, it is dissolved again in an acidic solution such as nitric acid and hydrochloric acid, then electrolyzed again, and separated and recovered by metal, and high purity is possible.
- an acidic solution such as nitric acid and hydrochloric acid
- the redox potential of Cu when using Ag / AgCl as a reference electrode is Cu + / Cu and Cu 2+ / Cu, which are 0.325 V and 0.141 V, respectively, and the redox potential of Ag ( Since it is smaller than 0.603 V) and larger than the oxidation-reduction potential of the other metal, it is possible to separate and recover Cu and other metals such as Ag by electrolysis.
- these oxides are insoluble in the above-mentioned HF aqueous solution, so that separation is facilitated, and subsequent preparation using an aqueous acidic solution such as an aqueous HNO 3 solution is about room temperature. The effect is that it becomes possible at a temperature of.
- metal copper can be recycled economically and with low energy.
- chemical reaction since only chemical reaction is used, it has the effect that it can be recycled as high-purity metallic copper.
- lead-containing solder is dissolved at the same time, it is also possible to recover lead by electrolysis after deposition of metallic copper.
- the present invention is also suitable as a method for separating and recovering a metal from a metal thin film or metal oxide thin film formed on a glass substrate or the like, and is not limited to the metal described in the embodiment of the present invention. It can also be applied to metals.
- an HF aqueous solution is mainly used.
- a waste HF aqueous solution in a semiconductor factory or an HF aqueous solution recycled from the HF aqueous solution can be used. Since preparation / precipitation is possible, there is an effect in reducing the environmental load such as economy and low generation of carbon dioxide (CO 2 ).
- the useful metal recycling method of the present invention can also be carried out after recycling the silica glass disclosed in Patent Document 8 (Japanese Patent Laid-Open No. 2000-335915) of the prior art.
- the present invention has a great effect on metal recycling.
- waste products of various flat panel displays such as liquid crystal panels, organic electroluminescence panels, plasma displays, waste cathode ray tubes, waste fluorescent tube glass, and waste solar battery panels are simultaneously pulverized and powdered.
- a useful metal recycling method is provided.
- the second invention is based on the first invention, and further includes a second dissolution step in which insoluble precipitates contained in the filtrate removed in the first filtration step are dissolved in pure water, and an aqueous solution produced in the second dissolution step.
- a useful metal recycling method further comprising a second useful metal recovery step of electrolyzing to deposit and recover various second useful metals.
- the third invention is based on the first invention, and further comprises a second dissolving step for dissolving insoluble precipitates contained in the filtrate removed in the first filtration step in pure water, and an aqueous solution produced in the second dissolving step.
- the second filtration step of removing the insoluble precipitate by filtration the third dissolution step of dissolving the insoluble precipitate contained in the filtrate removed in the second filtration step in the hydroiodic acid aqueous solution, and the third dissolution step
- a useful metal recycling method characterized by having a third useful metal recovery step of electrolyzing the produced aqueous solution to deposit and recover various third useful metals.
- the fourth invention is based on the first invention, and further includes various insoluble metal oxides and various metal fluorides contained in the filtrate removed in the first filtration step in an aqueous nitric acid solution and / or an aqueous hydrochloric acid solution, and / or sulfuric acid. Recycling useful metals characterized by having a fourth dissolving step for dissolving in an aqueous solution and a fourth useful metal collecting step for depositing and collecting various fourth useful metals by electrolyzing the aqueous solution produced in the fourth dissolving step Provide a method.
- the fifth invention is based on the first invention, and further includes a fifth dissolution step of dissolving copper contained in the filtrate removed in the first filtration step in an aqueous solution containing hydrofluoric acid and hydrogen peroxide, and a silicon substrate.
- a useful metal recycling method comprising a fifth useful metal recovery step of depositing and recovering a metal thin film by immersing an aluminum plate or an aluminum wire in the aqueous solution.
- a first dissolution step in which the powdered material is dissolved in an aqueous hydrofluoric acid solution to the extent that at least the glass is not melted, and the solution is filtered, insoluble various metal oxides, various metal fluorides, various metals
- the first filtration step to remove etc., and the filtrate containing various insoluble metal oxides, various metal fluorides, various metals, etc.
- a fourth dissolving step to be dissolved in the solution, and an aqueous solution produced in the fourth dissolving step is electrolyzed to precipitate various fourth useful metals.
- a method for recycling useful metals characterized in that it comprises a fourth useful metal recovery process which allowed to.
- the seventh invention is based on the fourth invention or the sixth invention, and further, after heating the aqueous solution produced in the fourth dissolution step, cooling and precipitating the metal salt, and the metal salt in pure water
- a method for recycling useful metals comprising: a sixth dissolving step for dissolving; and a sixth useful metal collecting step for depositing and collecting various sixth useful metals by electrolyzing the aqueous solution produced in the sixth dissolving step.
- various flat panel display waste products such as liquid crystal panels, organic electroluminescence panels, plasma displays, waste integrated circuits, waste printed circuit boards, or in-vehicle copper wiring harnesses, power cables, transmission / distribution wires, coaxial cables ,
- a pulverization process for simultaneously pulverizing any one or more of waste products such as parallel bilinear feeders and other copper wiring
- a second pulverization process for pulverizing if necessary, hydrofluoric acid and hydrogen peroxide and a seventh useful metal recovery step of depositing and recovering a metal thin film by immersing a silicon substrate, an aluminum plate, an aluminum wire or the like in the aqueous solution.
- the ninth invention on the basis of the fifth invention or the eighth invention, further, before or after the fifth useful metal recovery step or the seventh useful metal recovery step, depositing a metal ionized by electrolysis, provided is a useful metal recycling method characterized by having an eighth useful metal recovery step of recovering.
- the tenth invention is based on the fifth invention or the eighth invention, and is further produced in the fifth dissolution step or the seventh dissolution step before or after the fifth useful metal recovery step or the seventh useful metal recovery step.
- a useful metal recycling method characterized by further comprising a ninth useful metal recovery step of electrolyzing the produced aqueous solution to precipitate and recover an ionized metal.
- the eleventh invention is based on the tenth invention, and further, the aqueous solution produced in the eighth dissolution step is filtered to remove the insoluble precipitate, and the precipitate obtained in the fourth filtration step is A ninth dissolution step for dissolving in a hydroiodic acid aqueous solution, and a tenth useful metal recovery step for electrolyzing the aqueous solution produced in the ninth dissolution step to precipitate and recover various tenth useful metals Provide useful metal recycling methods.
- the twelfth invention provides a method for recycling useful metals based on the first invention or the second invention, wherein the first useful metal and the second useful metal are indium, zinc, silver or the like.
- the thirteenth invention provides a method for recycling a useful metal based on the third invention, wherein the third useful metal is tin.
- the fourth useful metal is a rare earth metal such as yttrium, europium, lanthanum, terbium, gadolinium, antimony, lead, etc. Provide recycling methods.
- the fifteenth invention provides a method for recycling useful metals based on the seventh invention, wherein the sixth useful metals are rare earth metals such as yttrium, europium, lanthanum, terbium, and gadolinium.
- the sixteenth invention provides a method for recycling useful metals based on the fifth invention or the eighth invention, wherein the fifth useful metal and the seventh useful metal are copper.
- the seventeenth invention provides a method for recycling useful metals based on the ninth invention, wherein the eighth useful metals are zinc, silver and copper.
- the eighteenth invention provides a method for recycling useful metals based on the tenth invention, wherein the ninth useful metals are lead, silver, and copper.
- the nineteenth invention provides a method for recycling useful metals based on the eleventh invention, wherein the tenth useful metal is tin.
- Embodiments 1 and 2 mainly relate to claims 1, 2, 3 and the like.
- the third embodiment mainly relates to claims 4, 6, 7, and the like.
- the fourth embodiment mainly relates to claims 4, 6, 10, 11 and the like.
- the fifth embodiment mainly relates to claims 5 and 8.
- the sixth embodiment mainly relates to claims 2 and 9.
- FIG. 2 and FIG. 3 show process flowcharts of the embodiment of the useful metal recycling method of the present invention.
- 25 and 26 show process flowcharts of the useful metal recycling method of the present invention expressed in accordance with the claims.
- FIG. 2 Indium and tin recovery from transparent electrode (ITO) (Fig. 2, 25)
- the present embodiment mainly relates to claims 1, 2, 3, and the like.
- the transparent electrode contains In 2 O 3 and tin oxide (SnO 2 )
- the hydrofluoric acid (HF) aqueous solution of In 2 O 3 and SnO 2 is used. The solubility was examined.
- the HF concentration in the present embodiment is preferably about 5 to 15% by weight. More desirably, the content is 10% by weight.
- the present invention was actually applied by utilizing a liquid crystal display panel of a liquid crystal display panel for a personal computer.
- the liquid crystal panel was recovered and the liquid crystal was collected, and then the glass substrate was washed with a neutral detergent to completely remove the liquid crystal. And after crushing this glass substrate, it was pulverized with the mixer (1st powdering process).
- the filtrate (gelled precipitate) obtained in the first filtration step was dissolved in pure water (second dissolution step). And using the aqueous solution produced
- the present embodiment mainly relates to claims 1, 2, 3 and the like, and describes a method of recovering zinc (Zn) from zinc oxide (ZnO), which has been studied as an alternative metal for indium for transparent electrodes.
- ZnO zinc oxide
- the HF concentration of the present embodiment is about 30% to 45% by weight. More desirably, the content is 40% by weight.
- Precipitation of a substance near gray was observed on the copper electrode on the cathode side, and an X-ray diffraction chart shown in FIG. 11 was obtained by X-ray diffraction analysis.
- the diffraction angle 2 ⁇ is 36.45 degrees, 39.15 degrees, 43.40 degrees, 54.50 degrees, 70.25 degrees, 70.80 degrees, 82.25 degrees, 86.70 degrees, and 90.10 degrees.
- Diffraction peaks of crystal plane orientation (002), (100), (101), (102), (103), (110), (112), (201), (104) are obtained and obtained, respectively.
- the material was found to be zinc (Zn) crystals.
- an aqueous solution was prepared by dissolving high-purity silica gel (SiO 2 ) powder in a simulated manner as in the first embodiment. After dissolving and saturating 6.0 g of high-purity silica gel (SiO 2 ) powder in 100 g of a HF aqueous solution for semiconductor having a concentration of 49% by weight, the purity is 99.0 so that the weight ratio of SiO 2 and ZnO is 10: 1. % ZnO powder 0.6 g was dissolved to prepare a solution. As before, a gel-like precipitate was produced.
- Electrolysis was performed at a liquid temperature of 24 ° C. for 1.25 hours.
- a platinum (Pt) plate and a copper (Cu) plate were used for the anode and the cathode, respectively. Note that both the platinum plate and the copper plate are insoluble in HF.
- Precipitation of a substance near gray was observed on the copper electrode on the cathode side, and an X-ray diffraction chart shown in FIG. 12 was obtained by X-ray diffraction analysis.
- the HF aqueous solution has the property of melting the glass contained in the waste product as described above. Therefore, by performing the step of dissolving the waste product with the HF aqueous solution until the glass contained in the waste product is not melted, it becomes possible to completely dissolve the useful metal adhering to the glass. As a result, the recovery rate of useful metals by subsequent electrolysis (such as the first useful metal recovery step) is improved. Moreover, it becomes possible to completely separate the useful metal described below that does not dissolve in the HF aqueous solution from the glass, and the subsequent treatment (fourth useful metal recovery step, etc.) described below efficiently removes the useful metal. It becomes possible to collect.
- Embodiment 3 Recovery of rare earth metals such as yttrium, europium, lanthanum and terbium from fluorescent materials
- the present embodiment mainly relates to claims 4, 6, 7 and the like. ⁇ Preliminary experiment of the first dissolution step and the fourth dissolution step>
- yttrium oxide Y 2 O 3
- europium oxide Eu 2 O 3
- lanthanum oxide La 2 O 3
- terbium oxide Tb 4 O 7
- a 49% concentration HF aqueous solution for semiconductor a 10% concentration nitric acid (HNO 3 ) aqueous solution, a 10% concentration sulfuric acid (H 2 SO 4 ) aqueous solution, and a 10% concentration hydrochloric acid (HCl) aqueous solution were used, respectively.
- HNO 3 10% concentration nitric acid
- SO 4 10% concentration sulfuric acid
- HCl 10% concentration hydrochloric acid
- Y 2 O 3 , Eu 2 O 3 , La 2 O 3 , and Tb 4 O 7 are all insoluble in HF aqueous solution, and the solubility in HNO 3 aqueous solution and H 2 SO 4 aqueous solution is greater than the solubility in HCl aqueous solution. found.
- the result is obtained by passing Y 2 O 3 , Eu 2 O 3 , La 2 O 3 , and Tb 4 O 7 into a precipitate (filter) through the first dissolution step and the first filtration step described in Embodiment 1. It is shown that it can be separated and recovered as a product. ⁇ Preliminary experiment of the fourth useful metal recovery process (yttrium recovery)>
- insoluble Y 2 O 3 was separated and recovered from a saturated aqueous solution in which 7.4 g of Y 2 O 3 powder was added to 100 g of HF aqueous solution having a concentration of 49%, and washed with pure water twice for 10 minutes. After that, it was dissolved in 50 g of an aqueous HNO 3 solution having a concentration of 10% by weight. Then, with the apparatus configuration shown in FIG. 5, electrolysis was performed at a DC applied voltage of 3.33 V, an average current of 1.91 mA, and a liquid temperature of 24 ° C. for 20 hours. As in the first embodiment, a platinum (Pt) plate was used as the electrode.
- the electrode part of the FL type waste fluorescent tube (40 W) was cut out to cut out only the glass part, and at the same time, mercury (Hg) in the waste fluorescent tube was recovered.
- the cut glass portion was pulverized and powdered with a mixer (first powdering step).
- the filtrate (insoluble precipitate) separated and recovered in the first filtration step was washed with pure water twice for 10 minutes, and then dissolved in 50 cc of an aqueous HNO 3 solution having a concentration of 10% by weight (fourth). Dissolution step). Thereafter, electrolysis was performed for 20 hours at a DC applied voltage of 3.3 V, an average current of 1.85 mA, and a liquid temperature of 24 ° C. with the apparatus configuration shown in FIG. 5 (fourth useful metal recovery step).
- This white coagulated product was dissolved in 100 g of pure water, and electrolysis was performed for 16.5 hours at a DC applied voltage of 3.00 V, an average current of 2.35 mA, and a liquid temperature of 24 ° C. with the apparatus configuration shown in FIG. A platinum (Pt) plate was used as the electrode. Precipitation of a brown substance was observed on the cathode-side platinum electrode, and an X-ray diffraction chart shown in FIG. 14 was obtained by X-ray diffraction analysis. Diffraction peaks with crystal plane orientations (110) and (211) were obtained at diffraction angles 2 ⁇ of 27.85 degrees and 49.60 degrees, respectively, and it was found that this material was europium (Eu) crystals. ⁇ Preliminary experiment 2 (lanthanum recovery) of the precipitation step, the sixth dissolution step, and the sixth useful metal recovery step>
- This white coagulated product was dissolved in 100 g of pure water, and electrolysis was performed for 18 hours at a DC applied voltage of 2.60 V, an average current of 1.77 mA, and a liquid temperature of 24 ° C. with the apparatus configuration shown in FIG. A platinum (Pt) plate was used as the electrode. Precipitation of a gray substance was observed on the cathode side platinum electrode, and an X-ray diffraction chart shown in FIG. 15 was obtained by X-ray diffraction analysis. When diffraction angle 2 ⁇ is 26.40 degrees, 28.40 degrees, 46.85 degrees, and 48.05 degrees, diffraction peaks of crystal plane orientations (100), (101), (105), and (110) are respectively obtained. This material was found to be lanthanum (La) crystals. ⁇ Preliminary experiment 3 (terbium recovery) of the precipitation step, the sixth dissolution step, and the sixth useful metal recovery step>
- TbE 4 O 7 powder 11.8 g was dissolved in 100 g of an aqueous HNO 3 solution having a concentration of 10% by weight, and 10 g of this solution was heated at a temperature of about 50 ° C. for about 4 hours using a hot stirrer. Thereafter, the mixture was cooled in a refrigerator at a temperature of 4 ° C. for 18 hours to obtain a white solid product having a weight of 3.25 g.
- This white coagulated material was dissolved in 100 g of pure water, and electrolysis was performed for 18 hours at a DC applied voltage of 2.48 V, an average current of 1.77 mA, and a liquid temperature of 24 ° C. with the apparatus configuration shown in FIG. A platinum (Pt) plate was used as the electrode. Precipitation of a silver-white substance weighing 0.02 g was observed on the cathode-side platinum electrode, and X-ray diffraction analysis revealed that this substance was terbium (Tb) crystal.
- Pt platinum
- Eu europium
- La lanthanum
- Tb terbium
- rare earth metals such as yttrium (Y) and gadolinium (Gd) can be separated and recovered by the precipitation step, the sixth dissolution step, and the sixth useful metal recovery step.
- the present embodiment mainly relates to claims 4, 6, 10, 11 and the like, and is a method of recovering antimony, lead, tin contained in solder, lead contained in oxide in fluorescent tube glass, CRT glass, etc. To state. ⁇ Preliminary experiment of the first dissolution process>
- antimony oxide (Sb 2 O 3 ) powder having a purity of 98.0% was dissolved in 100 g of a HF aqueous solution having a concentration of 49% by weight at a temperature of 24 ° C., and the solubility was examined.
- lead oxide (PbO) powder with a purity of 99.0% in 100 g of HF aqueous solution with a concentration of 49% by weight at a temperature of 24 ° C. a precipitate like lead fluoride was obtained, and the solubility was unknown. .
- Preliminary experiment 1 (antimony recovery) of the fourth useful metal recovery process >
- the diffraction angle 2 ⁇ is 23.65 degrees, 25.3 degrees, 28.8 degrees, 40.15 degrees, 42.15 degrees, 47.25 degrees, 48.5 degrees, 51.7 degrees, 59.55 degrees, At 63.1 degrees, 66.15 degrees, 68.9 degrees, 71.75 degrees, 76.05 degrees, 76.65 degrees, 91.5 degrees, and 98.6 degrees, the crystal plane orientation (003), (101), (012), (104), (110), (015), (006), (202), (024), (107), (116), (122), (108), (214 ), (300), (119), and (312) diffraction peaks were obtained, and this substance was found to be antimony (Sb) crystals. In addition, since the deposited Sb was as thick as 1 mm, the diffraction peak of the platinum electrode could not be observed. ⁇ This experiment>
- the electrode part of the FL type waste fluorescent tube (40 W) was cut out to cut out only the glass part, and at the same time, mercury (Hg) in the waste fluorescent tube was recovered.
- the cut glass portion was pulverized and powdered with a mixer (first powdering step).
- this precipitate was dissolved in 100 g of a 10% by weight HNO 3 aqueous solution (fourth dissolution step), and the apparatus configuration shown in FIG. 5 was used for 60 hours at a DC applied voltage of 1.0 V, an average current of 200 mA, and a liquid temperature of 24 ° C.
- a gray substance precipitate weighing 0.05 g was obtained on the platinum electrode on the cathode side.
- an X-ray diffraction chart shown in FIG. 17 was obtained.
- a platinum (Pt) plate was used as the electrode (fourth useful metal recovery step).
- 0.02 g of a gray matter deposit was observed on the platinum electrode on the cathode side.
- the X-ray diffraction chart shown in FIG. 19 was obtained.
- the crystal plane orientation is 31.30 degrees, 36.30 degrees, 52.20 degrees, 62.25 degrees, 65.30 degrees, 85.85 degrees, and 88.25 degrees, the crystal plane orientation (111),
- the diffraction peaks of (200), (220), (311), (222), (331), and (420) were obtained, and this substance was found to be lead (Pb) crystals.
- waste fluorescent tube glass and waste cathode ray tube glass were processed separately, but when similar experiments were performed using glass powders mixed with these, antimony and lead could be separated and recovered. It was. ⁇ Preliminary experiment of 9th useful metal recovery process (lead recovery)>
- lead was further separated and collected from Pb—Sn—Zn-based solder containing a large amount of lead.
- 120 g of HF / H 2 O 2 mixed solution prepared by adding 20 g of hydrogen peroxide water (H 2 O 2 ) having a concentration of 30% by weight to 100 g of HF aqueous solution for a semiconductor having a concentration of 49% by weight has a weight of 5 g.
- H 2 O 2 hydrogen peroxide water
- a white precipitate weighing 1.75 g was obtained.
- this precipitate was dissolved in 100 g of an aqueous HNO 3 solution having a concentration of 10% by weight, a white precipitate was further obtained.
- the aqueous solution obtained by filtering the precipitate through a filter was subjected to electrolysis for 60 hours at a DC applied voltage of 2.4 V, an average current of 100 mA, and a liquid temperature of 24 ° C. with the apparatus configuration shown in FIG.
- a platinum (Pt) plate was used as the electrode.
- a precipitate of gray material weighing 0.08 g was observed on the platinum electrode on the cathode side, and when this precipitate was analyzed by X-ray diffraction, the X-ray diffraction chart shown in FIG. 20 was obtained.
- Pure water is added to 100 g of a HF aqueous solution for semiconductor with a concentration of 49% by weight to prepare an aqueous HF solution with a concentration of 20% by weight, and 20 g of hydrogen peroxide (H 2 O 2 ) with a concentration of 30% by weight is added to 100 g of this HF aqueous solution.
- the printed circuit board piece of about 2 cm square was immersed in 120 g of the HF / H 2 O 2 mixed aqueous solution prepared at the temperature of 24 ° C. and left for 24 hours (fifth dissolving step or seventh dissolving step). At this time, the HF / H 2 O 2 mixed aqueous solution changed from colorless to blue, and about 1.0 g of a precipitate was obtained.
- Copper (Cu) described in Embodiment 5 was recovered from the aqueous solution obtained by filtering the precipitate (fifth useful metal recovery step or seventh useful metal recovery step).
- the precipitate obtained by filtration was dissolved in 100 g of 10% by weight HNO 3 aqueous solution (eighth dissolution step), and the apparatus configuration shown in FIG.
- electrolysis was performed for 60 hours at an average current of 100 mA and a liquid temperature of 24 ° C.
- the present embodiment mainly relates to claims 5 and 8. ⁇ Preliminary experiment of the fifth dissolution process and the seventh dissolution process>
- the solubility of copper, which is mainly used as a wiring material, in an HF aqueous solution was examined.
- pure water was added to an aqueous HF solution for semiconductor having a concentration of 49% by weight to prepare an aqueous HF solution having a concentration of 20% by weight.
- hydrogen peroxide water (H 2 O 2 ) having a concentration of 30% by weight was added to this HF aqueous solution at different concentrations, and 100 g of HF / H 2 O 2 mixed aqueous solution having different concentrations had a purity of 99.85%.
- 6 g of copper (Cu) powder was dissolved at a temperature of 24 ° C. This aqueous solution changed from colorless to blue before addition of copper.
- FIG. 21 shows the solubility of copper with respect to the hydrogen peroxide (H 2 O 2 ) concentration when copper powder is dissolved in an HF / H 2 O 2 mixed aqueous solution. An almost constant solubility was obtained at a hydrogen peroxide concentration of 20 to 60% by weight.
- pure water was added to the semiconductor for HF aqueous solution having a concentration of 49 wt%, to prepare an aqueous HF solution having a concentration of 20% by weight, in the aqueous HF solution 50 g, 30% strength by weight aqueous hydrogen peroxide (H 2 O 2 ) 3 g of copper (Cu) powder having a purity of 99.85% was dissolved in 100 g of an HF / H 2 O 2 mixed aqueous solution prepared by adding 50 g at a temperature of 24 ° C. and left for 24 hours.
- an Al wire having a diameter of 1 mm was immersed in a HF / H 2 O 2 mixed aqueous solution in which Cu was dissolved at a temperature of 24 ° C.
- Pure water is added to an aqueous HF solution for semiconductors having a concentration of 49% by weight to prepare an aqueous HF solution having a concentration of 20% by weight, and 50 g of hydrogen peroxide (H 2 O 2 ) having a concentration of 30% by weight is added to 50 g of the aqueous HF solution.
- the printed circuit board piece of about 2 cm square was immersed in 100 g of the HF / H 2 O 2 mixed aqueous solution prepared at a temperature of 24 ° C. and left for 24 hours (the fifth dissolving step or the seventh dissolving step). At this time, the HF / H 2 O 2 mixed aqueous solution changed from colorless to blue. Further, no change in appearance was observed in the parts other than the copper wiring of the printed circuit board and the electronic components.
- a Si substrate is used as a substrate on which metallic copper is deposited.
- metallic copper can be similarly deposited and recovered using an aluminum (Al) plate, aluminum (Al) wire, or the like. Confirm that there is.
- the waste copper wiring printed circuit board is used, but a variety of flat panel display waste products such as liquid crystal panels, organic electroluminescence panels, and plasma displays, and copper wiring such as waste integrated circuits are used. It is also applicable to electronic equipment and parts waste.
- the present invention can also be applied to wiring materials using metallic copper, for example, in-vehicle harnesses, power cables, power transmission / distribution wires, coaxial cables, parallel bilinear feeders, and other waste products.
- a copper-coated wire (Al New) from the HF / H 2 O 2 mixed aqueous solution of Cu powder, such as wasted printed circuit board in place of the Cu powder, those containing Cu If there is, it can be regenerated in the same way, and it can be regenerated and applied to various wirings such as harnesses, coated copper wires, and coaxial cables.
- the useful metal (copper) recovery method of the present embodiment may be performed from a step of pulverizing waste fluorescent tube glass or the like, and pulverizing as necessary. It is also possible to carry out by using the filtrate removed in the method for recovering useful metals described.
- the waste copper wiring printed circuit board piece is used, but a cullet shape or a fine powdered powder by a mixer may be used.
- the present embodiment mainly relates to claims 2 and 9 and the like, and describes a method for separating and collecting silver (Ag) from a plasma display panel and a waste copper wiring printed board using lead-free solder. ⁇ Preliminary experiment of eighth useful metal recovery process>
- the diffraction angle 2 ⁇ is 38.05 degrees, 44.25 degrees, 64.50 degrees, and 77.55 degrees
- the plasma display panel waste was pulverized, and the glass substrate was crushed and then pulverized by a mixer (first powdering step, or pulverizing step and second powdering step).
- the said powder is melt
- first filtration step After separating this insoluble precipitate from the solution by filtration (first filtration step), the filtrate is further dissolved in pure water to obtain an electrolytic solution (second dissolution step).
- second dissolution step Next, as described in the first embodiment, in the apparatus configuration shown in FIG. 5, after depositing and collecting indium by electrolysis, a voltage equal to or higher than the difference in redox potential between Ag and In (1.1371 V) is applied. Silver (Ag) can be deposited and recovered by increasing the pressure and performing electrolysis (second useful metal recovery step).
- a platinum plate electrode is used in the electrolysis, but this may be a carbon electrode or other electrode, or platinum depending on the metal species to be deposited and recovered.
- a thin film electrode in which a metal such as carbon, carbon, or the like is formed on a substrate such as glass may be used.
- Recycled In X-ray diffraction chart 1 which is an example of an embodiment of the present invention Recycled In X-ray diffraction chart 2 as an example of an embodiment of the present invention Recycled In X-ray diffraction chart 3 as an example of an embodiment of the present invention
- X-ray diffraction chart of In recycled from a glass substrate of a liquid crystal panel as an example of an embodiment of the present invention HF concentration dependence of solubility when zinc oxide (ZnO) powder as an example of the embodiment of the present invention is dissolved in HF aque
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Abstract
Description
奈良賢、佐々木秀光、山口大輔、菅原美智瑠、西村優、本間哲哉、高橋英郎、第65回応用物理学会学術講演会 講演予稿集、「廃棄シリカ系ガラス材料からの金属元素分離性能の評価」、講演番号 3p-E-8、p.354、2004年9月3日
佐々木秀光、山口大輔、西村優、奈良賢、本間哲哉、第52回応用物理学関係連合講演会 講演予稿集、「廃棄シリカ系ガラス材料からの金属元素分離性能の評価 (2)」、講演番号30a-YA-2、p.498、2005年3月30日
実施形態1.透明電極(ITO)からのインジウム、スズ回収(図2、25)
<第一溶解工程の予備実験1(SiO2を含有しない場合)>
<第一有用金属回収工程の予備実験1(SiO2を含有しない場合)>
<第一溶解工程の予備実験2(SiO2を含有する場合)>
<第一有用金属回収工程の予備実験2(SiO2を含有する場合)>
<第二溶解工程及び第二有用金属回収工程の予備実験>
<本実験>
実施形態2.透明電極用酸化亜鉛からの亜鉛の回収
<第一溶解工程の予備実験1(SiO2を含有しない場合)>
<第二溶解工程及び第二有用金属回収工程の予備実験1(SiO2を含有しない場合)>
<第一溶解工程及び第二溶解工程及び第二有用金属回収工程の予備実験2(SiO2を含有する場合)>
実施形態3.蛍光材料からのイットリウム、ユーロピウム、ランタン、テルビウム等の希土類金属の回収
<第一溶解工程及び第四溶解工程の予備実験>
<第四有用金属回収工程の予備実験(イットリウム回収)>
<本実験>
<析出工程及び第六溶解工程及び第六有用金属回収工程の予備実験1(ユーロピウム回収)>
<析出工程及び第六溶解工程及び第六有用金属回収工程の予備実験2(ランタン回収)>
<析出工程及び第六溶解工程及び第六有用金属回収工程の予備実験3(テルビウム回収)>
実施形態4.アンチモン、鉛、スズの回収
<第一溶解工程の予備実験>
<第四有用金属回収工程の予備実験1(アンチモン回収)>
<本実験>
<第四有用金属回収工程の予備実験2(鉛回収)>
<本実験>
<第九有用金属回収工程の予備実験(鉛回収)>
<本実験>
実施形態5.銅の回収
<第五溶解工程及び第七溶解工程の予備実験>
Cu+H2O2→Cu(OH)2 -(1)
Cu(OH)2+4HF→H2CuF4+2H2O -(2)
H2CuF4→2H++[CuF4]2- -(3)
<第五有用金属回収工程及び第八有用金属回収工程の予備実験1(Si基板片利用)>
[CuF4]2-+2H+
→[Cu2 ++2e-]+[F4 4--2e-]+2H+
→Cu+2HF+F2 -(4)
と推定できる。
<第五有用金属回収工程及び第八有用金属回収工程の予備実験2(Al線利用)>
<本実験>
実施形態6.銀の回収
<第八有用金属回収工程の予備実験>
<第二有用金属回収工程の予備実験>
4・・・ 処理水溶液、 5・・・ 直流電圧計、 6・・・ 直流電流計、
7・・・ 直流安定化電源
Claims (19)
- 液晶パネル、有機エレクトロルミネッセンスパネル、プラズマディスプレイ等の各種フラットパネルディスプレイの廃棄品、廃棄ブラウン管、廃棄蛍光管ガラス、廃棄太陽電池パネルのいずれか一以上を同時に粉砕し、粉末化せしめる第一粉末化工程と、
粉末化した材料をフッ化水素酸水溶液にて少なくともガラスがとけてなくなる程度まで溶解せしめる第一溶解工程と、
前記溶液をろ過し、不溶の各種金属酸化物、各種金属フッ化物、各種金属などを取り除く第一ろ過工程と、
各種金属イオンを含有するろ液を電気分解して各種第一有用金属を析出、回収せしめる第一有用金属回収工程と、
を有することを特徴とする有用金属のリサイクル方法。 - 第一ろ過工程で取り除いたろ物に含まれる不溶の沈殿物を純水に溶解せしめる第二溶解工程と、
第二溶解工程で生成した水溶液を電気分解して各種第二有用金属を析出、回収せしめる第二有用金属回収工程をさらに有することを特徴とする請求項1に記載の有用金属のリサイクル方法。 - 第一ろ過工程で取り除いたろ物に含まれる不溶の沈殿物を純水に溶解せしめる第二溶解工程と、
第二溶解工程で生成した水溶液をろ過し、不溶の沈殿物を取り除く第二ろ過工程と、
第二ろ過工程で取り除いたろ物に含まれる不溶の沈殿物をヨウ化水素酸水溶液に溶解せしめる第三溶解工程と、
第三溶解工程で生成した水溶液を電気分解して各種第三有用金属を析出、回収せしめる第三有用金属回収工程をさらに有することを特徴とする請求項1に記載の有用金属のリサイクル方法。 - 第一ろ過工程で取り除いたろ物に含まれる不溶の各種金属酸化物、各種金属フッ化物を硝酸水溶液、及び/又は塩酸水溶液、及び/又は硫酸水溶液に溶解せしめる第四溶解工程と、
第四溶解工程で生成した水溶液を電気分解して各種第四有用金属を析出、回収せしめる第四有用金属回収工程を有することを特徴とする請求項1に記載の有用金属のリサイクル方法。 - 第一ろ過工程で取り除いたろ物に含まれる銅をフッ化水素酸と過酸化水素を含有する水溶液に溶解せしめる第五溶解工程と、
シリコン基板、又はアルミニウム板、又はアルミニウム線等を前記水溶液に浸漬して金属薄膜を析出、回収せしめる第五有用金属回収工程を有することを特徴とする請求項1に記載の有用金属のリサイクル方法。 - 液晶パネル、有機エレクトロルミネッセンスパネル、プラズマディスプレイ等の各種フラットパネルディスプレイの廃棄品、廃棄ブラウン管、廃棄蛍光管ガラスのいずれか一以上を同時に粉砕し、粉末化せしめる第一粉末化工程と、
粉末化した材料をフッ化水素酸水溶液にて少なくともガラスがとけてなくなる程度まで溶解せしめる第一溶解工程と、
前記溶液をろ過し、不溶の各種金属酸化物、各種金属フッ化物、各種金属などを取り除く第一ろ過工程と、
第一ろ過工程で取り除いた不溶の各種金属酸化物、各種金属フッ化物、各種金属などを含むろ物を硝酸水溶液、及び/又は塩酸水溶液、及び/又は硫酸水溶液に溶解せしめる第四溶解工程と、
第四溶解工程で生成した水溶液を電気分解して各種第四有用金属を析出、回収せしめる第四有用金属回収工程と、
を有することを特徴とする有用金属のリサイクル方法。 - 第四溶解工程で生成した水溶液を加熱した後、冷却して金属塩を析出させる析出工程と、
前記金属塩を純水に溶解せしめる第六溶解工程と、
第六溶解工程で生成した水溶液を電気分解して各種第六有用金属を析出、回収せしめる第六有用金属回収工程を有することを特徴とする請求項4又は6に記載の有用金属のリサイクル方法。 - 液晶パネル、有機エレクトロルミネッセンスパネル、プラズマディスプレイ等の各種フラットパネルディスプレイの廃棄品、廃棄集積回路、廃棄プリント基板、あるいは、車載用銅配線ハーネス、電力ケーブル、送配電線、同軸ケーブル、平行二線形給電線、その他銅配線等の廃棄品のいずれか一以上を同時に粉砕する粉砕工程と、
必要に応じて粉末化せしめる第二粉末化工程と、
フッ化水素酸と過酸化水素を含有する水溶液に溶解せしめる第七溶解工程と、
シリコン基板、又はアルミニウム板、又はアルミニウム線等を前記水溶液に浸漬して金属薄膜を析出、回収せしめる第七有用金属回収工程と、
を有することを特徴とする有用金属のリサイクル方法。 - 前記第五有用金属回収工程又は第七有用金属回収工程の前、又は、後に、電気分解によりイオン化している金属を析出、回収せしめる第八有用金属回収工程をさらに有することを特徴とする請求項5又は8に記載の有用金属のリサイクル方法。
- 前記第五有用金属回収工程又は第七有用金属回収工程の前、又は、後に、第五溶解工程又は第七溶解工程で生成した水溶液をろ過し、不溶の沈殿物を取り除く第三ろ過工程と、
第三ろ過工程で得られた沈殿物を、硝酸水溶液等の酸水溶液に溶解する第八溶解工程と、
第八溶解工程で生成した水溶液を電気分解し、イオン化している金属を析出、回収せしめる第九有用金属回収工程をさらに有することを特徴とする、請求項5又は8に記載の有用金属のリサイクル方法。 - 第八溶解工程で生成した水溶液をろ過し、不溶の沈殿物を取り除く第四ろ過工程と、
第四ろ過工程で得られた沈殿物をヨウ化水素酸水溶液に溶解せしめる第九溶解工程と、
第九溶解工程で生成した水溶液を電気分解して各種第十有用金属を析出、回収せしめる第十有用金属回収工程をさらに有することを特徴とする請求項10に記載の有用金属のリサイクル方法。 - 第一有用金属および第二有用金属が、インジウム、亜鉛、銀等であることを特徴とする、請求項1又は2に記載の有用金属のリサイクル方法。
- 第三有用金属が、スズであることを特徴とする、請求項3に記載の有用金属のリサイクル方法。
- 第四有用金属が、イットリウム、ユーロピウム、ランタン、テルビウム、ガドリニウム等の希土類金属、アンチモン、鉛であることを特徴とする、請求項4又は6に記載の有用金属のリサイクル方法。
- 第六有用金属が、イットリウム、ユーロピウム、ランタン、テルビウム、ガドリニウム等の希土類金属であることを特徴とする、請求項7に記載の有用金属のリサイクル方法。
- 第五有用金属および第七有用金属が、銅であることを特徴とする、請求項5又は8に記載の有用金属のリサイクル方法。
- 第八有用金属が、亜鉛、銀、銅であることを特徴とする、請求項9に記載の有用金属のリサイクル方法。
- 第九有用金属が、鉛、銀、銅であることを特徴とする、請求項10に記載の有用金属のリサイクル方法。
- 第十有用金属が、スズであることを特徴とする、請求項11に記載の有用金属のリサイクル方法。
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Also Published As
Publication number | Publication date |
---|---|
CN101909770A (zh) | 2010-12-08 |
JPWO2009087908A1 (ja) | 2011-05-26 |
EP2241381A1 (en) | 2010-10-20 |
KR101312775B1 (ko) | 2013-09-27 |
CN101909770B (zh) | 2014-05-07 |
KR20100106551A (ko) | 2010-10-01 |
EP2241381A4 (en) | 2011-11-09 |
US20110017020A1 (en) | 2011-01-27 |
US8317896B2 (en) | 2012-11-27 |
JP5403814B2 (ja) | 2014-01-29 |
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